Chip-on-glass bonding using sn bump and non-conductive adhesive for LCD application

Molecular Crystals and Liquid Crystals

Volumn 458, Issue 1, 2006, Pages 199-206

  Kim, Bae Yong ^a   Chen, Zhigang ^a   Kim, Young Ho ^a  

^a Hanyang University   (South Korea)

Author keywords

Chip on glass (COG); Non conductive adhesive (NCA); Sn bump; Thermal cycling

Indexed keywords

ADHESIVES; ELECTRIC RESISTANCE; GLASS BONDING; SILICON; THERMAL CYCLING; THERMAL EFFECTS;

CHIP ON GLASS (COG); GLASS SUBSTRATES; NON CONDUCTIVE ADHESIVES (NCA); SN BUMPS;

LIQUID CRYSTAL DISPLAYS;

EID: 33845333848     PISSN: 15421406     EISSN: 15635287     Source Type: Journal    
DOI: 10.1080/15421400600932363     Document Type: Conference Paper

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