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Volumn 48, Issue 1, 2007, Pages 37-43

Fine pitch and low temperature bonding using solder bumps and the assessment of solder joint reliability

Author keywords

COG (chip on glass) bonding; Flip chip bonding; NCA (non conductive adhesive) bonding; Reliability test

Indexed keywords

CONTACT RESISTANCE; RELIABILITY ANALYSIS; SCANNING ELECTRON MICROSCOPY; SOLDERING; THERMAL CYCLING; TIN; X RAY SPECTROSCOPY;

CHIP ON GLASS (COG) BONDING; FLIP CHIP BONDING; FOUR POINT PROBE METHODS; NON CONDUCTIVE ADHESIVES (NCA) BONDING; PITCH;

SOLDERED JOINTS;

EID: 33847713366 PISSN: 13459678 EISSN: None Source Type: Journal
DOI: 10.2320/matertrans.48.37 Document Type: Article

Times cited : (9)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.