Thermal stability performance of anisotropic conductive film at different bonding temperatures

Microelectronics Reliability

Volumn 44, Issue 3, 2004, Pages 495-503

  Tan, S C ^a   Chan, Y C ^a   Chiu, Y W ^a   Tan, C W ^a  

^a CITY UNIVERSITY OF HONG KONG   (Hong Kong)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; ANISOTROPY; BONDING; CROSSLINKING; CURING; FOURIER TRANSFORM INFRARED SPECTROSCOPY; PYROLYSIS; STRENGTH OF MATERIALS; THERMODYNAMIC STABILITY; THERMOGRAVIMETRIC ANALYSIS;

ANISOTROPIC CONDUCTIVE FILMS (ACF); BONDING TEMPERATURES;

CONDUCTIVE FILMS;

EID: 1142263930     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0026-2714(03)00239-7     Document Type: Article

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