Au bump interconnection with ultrasonic flip-chip bonding in 20 μm pitch

Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers

Volumn 42, Issue 4 B, 2003, Pages 2198-2203

  Tanida, Kazumasa ^a   Umemoto, Mitsuo ^a   Tomita, Yoshihiro ^a   Tago, Masamoto ^a   Kajiwara, Ryoichi ^a   Akiyama, Yukiharu ^a   Takahashi, Kenji ^a  

^a ASSOCIATION OF SUPER ADVANCED ELECTRONICS TECHNOLOGIES ASET   (Japan)

Author keywords

Au Au; Chip on chip (COC); Electronic system integration; Solid phase diffusion; Thermo compression bonding; Three dimensional (3D) chip stacking LSI; Ultrasonic flip chip bonding

Indexed keywords

CRYSTAL ATOMIC STRUCTURE; DIFFUSION IN SOLIDS; ELECTRODES; ELECTRONICS PACKAGING; ELECTROPLATING; GOLD; INTERFACES (MATERIALS); LSI CIRCUITS; OPTIMIZATION; THERMAL EFFECTS; THREE DIMENSIONAL; ULTRASONICS;

BUMP INTERCONNECTION; CHIP ON CHIP; ELECTRONIC SYSTEM INTEGRATION; SOLID PHASE DIFFUSION; THERMO COMPRESSION BONDING; THREE DIMENSIONAL CHIP STACKING; ULTRASONIC FLIP CHIP BONDING;

FLIP CHIP DEVICES;

EID: 0037672003     PISSN: 00214922     EISSN: None     Source Type: Journal    
DOI: 10.1143/jjap.42.2198     Document Type: Article

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