Effects of thermoplastic resin content of anisotropic conductive films on the pressure cooker test reliability of anisotropic conductive film flip-chip assembly

Journal of Electronic Materials

Volumn 34, Issue 11, 2005, Pages 1455-1461

  Hwang, J W ^a   Yim, M J ^a   Paik, K W ^a  

^a Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

Author keywords

Anisotropic conductive film (ACF); Flip chip; Pressure cooker test (PCT); Reliability; Thermoplastic content; Water absorption

Indexed keywords

ANISOTROPY; CONDUCTIVE FILMS; ELASTIC MODULI; FLIP CHIP DEVICES; MECHANICAL PROPERTIES; RELIABILITY; THERMAL EXPANSION; WATER ABSORPTION;

ANISOTROPIC CONDUCTIVE FILMS (ACF); FLIP CHIP; PRESSURE COOKER TEST (PCT); THERMOPLASTIC CONTENT;

THERMOPLASTIC ELASTOMERS;

EID: 28044466024     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-005-0205-3     Document Type: Article

References (9)

1. A. Nagai, K. Takemura, K. Isaka, O. Watanabe, K. Kojima, K. Matsuda, and I. Watanabe, IEMT/IMC Proc., p. 353 (1998).
2. M.J. Yim, Y.D. Jeon, and K.W. Paik, IEEE Trans. Electron. Packaging Manufacturing, p. 171, 2000.
3. M. Dernevik, R. Sihlborn, K. Axelsson, Z. Lai, J. Liu, and P. Starski, Proc. 48th Electron. Comp. Technol. Conf., p. 1026 (1998).
4. R.J. Varley, J.H. Hodgkin, and G.P. Simon, J. Appl. Polymer Sci. 77, 237 (2000).
5. K. Sridhar and Thein Kyu, J. Appl. Polymer Sci. 77, 1257 (2000).
6. C. Nightingale and R.J. Day, Composites: Part A 33, 1021 (2002).
7. W.S. Kwon and K.W. Paik, Int. J. Adhesion Adhesives 24, 135 (2004).
8. L. Shan, K.N.E. Verghese, C.G. Robertson, and K.L. Reifsnider, J. Polymer Sci.: Part B: Polymer Phys. 37, 2815 (1999).
9. L.E. Nielsen, J. Macromol. Sci.-Rev. Macromol. Chem., Part C 3, 69 (1969).