Processability and reliability of nonconductive adhesives (NCAs) in fine-pitch chip-on-flex applications

Journal of Electronic Materials

Volumn 35, Issue 3, 2006, Pages 443-452

  Chiang, W K ^a   Chan, Y C ^a   Ralph, Brian ^b   Holland, Andrew ^b  

^a CITY UNIVERSITY OF HONG KONG   (Hong Kong)

^b BRUNEL UNIVERSITY   (United Kingdom)

Author keywords

Contact resistance; Fine pitch; NCA; Nonconductive adhesive; Reliability

Indexed keywords

CHIP BUMPS; CHIP ON FLEX APPLICATIONS; FINE PITCH; HYGROSCOPIC SWELLING; NONCONDUCTIVE ADHESIVES;

ABSORPTION; DELAMINATION; ENVIRONMENTAL TESTING; INTERCONNECTION NETWORKS; MOISTURE; RELIABILITY; STABILITY; SWELLING; THERMAL EXPANSION;

ADHESIVES;

EID: 33645577091     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/BF02690531     Document Type: Article

References (17)

1. R. Haug, U. Behner, C.-P. Czaya, H.-J. Jiang, K. Stefan, S. Reiner, and C.P.O. Treuteler, IEEE Trans. Electron. Packaging 23, 12 (2000).
2. H. Kristiansen and J. Liu, IEEE Trans. Compon. Packaging, Part A 21, 208 (1998).
3. S. Liong, C.P. Wong, and W.F. Burgoyne, IEEE Trans. Compon. Packaging Technol. 28, 327 (2005).
4. D. Klosterman, L. Li, and J.E. Morris, IEEE Trans. Compon. Packaging, Part A 21, 23 (1998).
5. S.H. Mannan, D.C. Whalley, A.O. Ogunjimi, and D.J. Williams, International Symposium on Electronic Manufacturing Technology (Piscataway, NJ: IEEE, 1995), pp. 142-145.
6. H. Kristiansen and A. Bjorneklett, J. Electron. Manuf. 2, 7 (1992).
7. J. Vanfleteren, B. Vandecasteele, and T. Podprocky, Electronics Packaging Technology Conference (Piscataway, NJ: IEEE, 2002), pp. 139-143.
8. J.C. Jagt, IEEE Trans. Compon. Packaging, Part A 21, 215 (1998).
9. D.E. Pachucki, IEEE Trans. Compon. Packaging, Part A 18, 3 (1995).
10. H.C. Cheng, C.L. Ho, K.N. Chiang, and S.M. Chang, IEEE Trans. Compon. Packaging Technol. 27, 398 (2004).
11. W.K. Chiang and Y.C. Chan, J. Electron. Packag. 127, 113 (2005).
12. L. Cao, Z. Lai, and J. Liu, Proceedings of the Sixth IEEE CPMT Conference on High-Density Microsystem Design and Packaging and Component Failure Analysis (Piscataway, NJ: IEEE, 2004), pp. 254-258.
13. R.H. Estes, International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces (Piscataway, NJ: IMAPS, IEEE, 2000), pp. 1-6.
14. L.L. Mercado, J. White, V. Sarihan, and T.-Y.T. Lee, IEEE Trans. Compon. Packaging Technol. 26, 509 (2003).
15. K.W. Paik, M.J. Yim, and Y.-D. Jeon, Proceedings of 3rd Electronics Packaging Technology Conference (Piscataway, NJ: IEEE, 2000), pp. 378-384.
16. R. Dudek, A. Schubert, and B. Michel IV, International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing Proceedings (Piscataway, NJ: IEEE, 2000), pp. 77-85.
17. M.J. Yim and K.W. Paik, IEEE Trans. Adv. Packaging 22, 166 (1999).