ZResists for sub-20-nm electron beam lithography with a focus on HSQ: State of the art

Nanotechnology

Volumn 20, Issue 29, 2009, Pages

  Grigorescu, A E ^a   Hagen, C W ^a  

^a DELFT UNIVERSITY OF TECHNOLOGY   (Netherlands)

Author keywords

[No Author keywords available]

Indexed keywords

BAKING TEMPERATURE; CONVENTIONAL METHODS; DEVELOPMENT PROCESS; E-BEAM RESIST; ELECTRON BEAM RESIST; ELECTRON-BEAM EXPOSURE; ETCH RESISTANCE; EXPOSURE DOSE; FEATURE SIZES; HIGH ACCELERATION; HIGH RESOLUTION; HIGH SENSITIVITY; HYDROGEN SILSESQUIOXANE; INORGANIC METALS; INORGANIC RESIST; LARGE SCALE INTEGRATION; LOW TEMPERATURES; MATERIAL PROPERTY; NANOFABRICATION PROCESS; NANOSTRUCTURE FABRICATION; NM RESOLUTION; RESIST LAYERS; RESIST MATERIALS; SMALL FEATURES; STATE OF THE ART; ULTRA-THIN;

ELECTRON BEAMS; ELECTRONS; HYDROGEN; METAL SPINNING; NANOSTRUCTURES; PHOTORESISTS; SELF ASSEMBLED MONOLAYERS; STRATEGIC PLANNING; SURFACE ROUGHNESS;

ELECTRON BEAM LITHOGRAPHY;

HALIDE; HYDROGEN; NANOCOMPOSITE; NANOMATERIAL; NANOPARTICLE; POLY(METHYL METHACRYLATE); SELF ASSEMBLED MONOLAYER; ORGANOSILICON DERIVATIVE;

CHEMICAL ANALYSIS; CHEMICAL STRUCTURE; ELECTRIC POTENTIAL; ELECTRON BEAM; HIGH TEMPERATURE; LOW TEMPERATURE; MATERIAL COATING; NANOFABRICATION; OPTICAL RESOLUTION; PARTICLE SIZE; PRIORITY JOURNAL; PRODUCT DEVELOPMENT; RADIATION DOSE; RADIATION EXPOSURE; REVIEW; ULTRAVIOLET RADIATION; X RAY; ATOMIC FORCE MICROSCOPY; CHEMISTRY; ELECTRON; METHODOLOGY; NANOTECHNOLOGY; PHOTOGRAPHY; PRINTING; SCANNING ELECTRON MICROSCOPY;

ELECTRONS; MICROSCOPY, ATOMIC FORCE; MICROSCOPY, ELECTRON, SCANNING; NANOCOMPOSITES; NANOSTRUCTURES; NANOTECHNOLOGY; ORGANOSILICON COMPOUNDS; PHOTOGRAPHY; PRINTING;

EID: 67651177764     PISSN: 09574484     EISSN: 13616528     Source Type: Journal    
DOI: 10.1088/0957-4484/20/29/292001     Document Type: Review

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