Materials issues with thin film hydrogen silsesquioxane low K dielectrics

Journal of the Electrochemical Society

Volumn 145, Issue 11, 1998, Pages 4019-4025

  Albrecht, M Grant ^a   Blanchette, Craig ^a,b  

^a TEXAS INSTRUMENTS   (United States)

^b WORCESTER POLYTECHNIC INSTITUTE   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL BONDS; COMPOSITION; CURING; DIELECTRIC MATERIALS; FOURIER TRANSFORM INFRARED SPECTROSCOPY; HEAT TREATMENT; MOLECULAR STRUCTURE; PERMITTIVITY; REACTION KINETICS; THERMODYNAMIC STABILITY; THIN FILMS; X RAY PHOTOELECTRON SPECTROSCOPY;

HYDROGEN SILSESQUIOXANE; THERMAL DESORPTION SPECTRA;

SILICONES;

EID: 0032205744     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1838907     Document Type: Article

References (21)

1. J. Wataerloos, H. Meynen, B. Coenegrachts, T. Gao, J. Grillaert, and L. Van den hove, No. 97-ISMIC-222D, in Proceedings of the 3rd International Dielectrics for ULSI Multilevel Interconnection Conference, DUMIC, p. 310, Santa Clara, CA, Feb 10-11 (1997).
2. S. Bothra, L. Q. Qian, M. Weiling, and D. Pramanik, No. 97-ISMIC-222D, in Proceedings of the 3rd International Dielectrics for ULSI Interconnection Conference, DUMIC, p. 273, Santa Clara, CA, Feb 10-11 (1997).
3. V. McGayay, A. Acovic, B. Argarwala, G. Endicott, M. Shapiro, and S. Yankee, No. 96-ISMIC-106, in Proceedings of the 13th International VLSI Multilevel Interconnection Conference, VMIC, p. 116, June 18-20, 1996.
4. M. K. Jain, K. J. Taylor, G. A. Dixit, W. W. Lee, L. M. Ting, G. B. Shih, S. Nag, R. Havermann, J. D. Luttmer, and M. Chang, No. 96-ISMIC-06, in Proceedings of the 13th International VLSI Multilevel Interconnection Conference, VMIC, p. 23, June 18-20, 1996.
5. B. T. Ahlburn and K. A. Scheibert, No. 94-ISMIC-103, in Proceedings of the 11th International VLSI Multilevel Interconnection Conference, VMIC, p. 120, June 7-8, 1994.
6. R. Leung, T. Nakakano, S. Case, B. Sung, J. Yang, and D. K. Choi, No. 97-ISMIC-222D, in Proceedings of the 3rd International Dielectrics for ULSI Multilevel Interconnection Conference, DUMIC, p. 49, Santa Clara, CA, Feb 10-11 (1997).
7. M. Kuisl, Thin Solid Films, 157, 129 (1988).
8. J. N. Bremmer, Y. Liu, K. G. Gruszynski, and F. C. Dall, in Proceedings of the Spring Meeting, Materials Research Society, Vol. 407, p. 37, San Francisco, CA, April 1-4, 1997.
9. E. Sabin and G. Albrecht, Abstract 256, p. 320, The Electrochemical Society Meeting Abstracts, Vol. 97-1, Montreal, Quebec, Canada, May 4-9, 1997.
10. P. Bornhauser and G. Calzaferri, Spectrochim. Acta, Part A, 46, 1045 (1990).
11. P. Bornhauser and G. Calzaferri, J. Phys. chem., 100, 2035 (1996).
12. C. L. Frye and W. T. Collins, J. Am. Chem. Soc., 92, 5586 (1970).
13. V. Belot, R. Corriu, D. Leclercq, P. H. Mutin, and V. Vioux, Chem. Mater., 3, 127 (1991).
14. G. Lucovsky, J. Yang, S. S. Chao, J. E. Tyler, and W. Czubatyj, Phys. Rev. B, 28, 3225 (1983).
15. W. B. Pollard and G. Lucovsky, Phys. Rev. B, 26, 3172 (1982).
16. D. Seyferth, C. Prud homme, and G. H. Wiseman, Inorg. Chem., 22, 2163 (1983).
17. P. Gupta, V. L. Colvin, and S. M. George, Phys. Rev. B, 37, 8234 (1988).
18. V. A. Chubarov, M. A. Masenkis, Y. V. Zherdev, Y. D. Avrasin, and K. A. Andranov, Polym. Sci. U.S.S.R., 15, 2981 (1973).
19. P. Bornhauser and G. Calzaferri, J. Phys. Chem., 100, 2035 (1966).
20. M. Laboda, in Proceedings of Dow Corning Users' Group Technical Meeting, pp. 1-10, Santa Clara, CA, June 6, 1997.
21. G. Calzaferri and R. Hoffman, J. Chem. Soc., Dalton Trans., 917 (1991).