-
1
-
-
0020127035
-
Silicon as a mechanical material
-
Petersen, K.E. Silicon as a mechanical material. Proc. IEEE 70, (1982), pp. 420-457.
-
(1982)
Proc. IEEE
, vol.70
, pp. 420-457
-
-
Petersen, K.E.1
-
3
-
-
0020765912
-
Polycrystalline Silicon Micromechanical Beams
-
Howe, R., Muller, R. Polycrystalline Silicon Micromechanical Beams. J. Electrochem. Soc., Vol. 130, (1983), pp. 1420-1423.
-
(1983)
J. Electrochem. Soc.
, vol.130
, pp. 1420-1423
-
-
Howe, R.1
Muller, R.2
-
4
-
-
3943070464
-
Critical review: Adhesion in surface micromechanical structures
-
Maboudian, R., Howe, R.T. Critical review: Adhesion in surface micromechanical structures. J. Vac. Sci. Technol. B, Vol. 15, (1997), pp. 1-20. (Pubitemid 127574161)
-
(1997)
Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures
, vol.15
, Issue.1
, pp. 1-20
-
-
Maboudian, R.1
Howe, R.T.2
-
5
-
-
0024034768
-
FINE-GRAINED POLYSILICON FILMS WITH BUILT-IN TENSILE STRAIN
-
DOI 10.1109/16.2534
-
Guckel, H., Burns, D. W., Visser, C.C.G., Tilmans H.A.C., Deroo, D. Fine-Grained Polysilicon Films with Built-In Tensile Strain. IEEE Trans. On Electron Devices, Vol. 35, No. 6, (1988), pp. 800-801. (Pubitemid 18639639)
-
(1988)
IEEE Transactions on Electron Devices
, vol.35
, Issue.6
, pp. 800-801
-
-
Guckel, H.1
Burns, D.W.2
Visser, C.C.G.3
Tilmans, H.A.C.4
Deroo, D.5
-
6
-
-
0026370560
-
Control of residual stress of polysilicon thin films by heavy doping in surface micromachining
-
Orpana, M., Korhonen, A. Control of residual stress of polysilicon thin films by heavy doping in surface micromachining. Digest of Technical Papers 1991 International Conference on Solid-State Sensors and Actuators, Transducers '91, (1991), pp. 957-960.
-
Digest of Technical Papers 1991 International Conference on Solid-State Sensors and Actuators, Transducers '91, (1991)
, pp. 957-960
-
-
Orpana, M.1
Korhonen, A.2
-
7
-
-
0024032417
-
Integrated Fabrication of Polysilicon Mechanisms
-
Mehregany M., Gabriel, K.J., Trimmer, W.S.N. Integrated Fabrication of Polysilicon Mechanisms. IEEE Transactions on Electron Devices, Vol. ED-35, No. 6, (1988), pp. 719-723.
-
(1988)
IEEE Transactions on Electron Devices
, vol.ED-35
, Issue.6
, pp. 719-723
-
-
Mehregany, M.1
Gabriel, K.J.2
Trimmer, W.S.N.3
-
8
-
-
0024136894
-
Polysilicon Microbridge Fabrication Using Standard CMOS Technology
-
Parameswaran, M., Baltes, H.P., Robinson, A.M. Polysilicon Microbridge Fabrication Using Standard CMOS Technology. Tech Digest of Solid-State Sensor and Actuator Workshop, June, (1988), pp. 148-150.
-
Tech Digest of Solid-State Sensor and Actuator Workshop, June, (1988)
, pp. 148-150
-
-
Parameswaran, M.1
Baltes, H.P.2
Robinson, A.M.3
-
9
-
-
0032138470
-
Surface Micromachining for Microelectromechanical Systems
-
Bustillo, J.M., Howe, R.T., Muller, R.S. Surface Micromachining for Microelectromechanical Systems. Proc. IEEE, Vol. 86, No. 8, (1998), pp. 1552-1574.
-
(1998)
Proc. IEEE
, vol.86
, Issue.8
, pp. 1552-1574
-
-
Bustillo, J.M.1
Howe, R.T.2
Muller, R.S.3
-
10
-
-
0002202939
-
Application of chemical-mechanical polishing to planarization of surface-micromachined devices
-
Nasby, R., Sniegowski, J., Smith, J., Montague, S., Barron, C., Eaton, W., McWhorter, P., Hetherington, D., Apblett, C., Fleming, J. Application of chemical-mechanical polishing to planarization of surface-micromachined devices. Proc. Solid-State Sensor and Actuator Workshop, (1996), pp. 48-53.
-
Proc. Solid-State Sensor and Actuator Workshop, (1996)
, pp. 48-53
-
-
Nasby, R.1
Sniegowski, J.2
Smith, J.3
Montague, S.4
Barron, C.5
Eaton, W.6
McWhorter, P.7
Hetherington, D.8
Apblett, C.9
Fleming, J.10
-
11
-
-
84886448140
-
Multi-layer enhancement to polysilicon surface-micromachining technology
-
Technical Digest
-
Sniegowski, J.J., Rodgers, M.S. Multi-layer enhancement to polysilicon surface-micromachining technology. Electron Devices Meeting, 1997. Technical Digest, (1997), pp. 903-906.
-
(1997)
Electron Devices Meeting, 1997
, pp. 903-906
-
-
Sniegowski, J.J.1
Rodgers, M.S.2
-
12
-
-
0018030427
-
Anisotropic Etching of Silicon
-
Bean, K.E. Anisotropic Etching of Silicon. IEEE Transaction on Electron Devices, Vol. ED-25, No. 10, (1978), pp. 1185-1193.
-
(1978)
IEEE Transaction on Electron Devices
, vol.ED-25
, Issue.10
, pp. 1185-1193
-
-
Bean, K.E.1
-
13
-
-
0032139387
-
Bulk micromachining of silicon
-
PII S0018921998051214
-
Kovacs, G.T., Maluf, N.I., Petersen K.E. Bulk Micromachining of Silicon. Proc. IEEE, Vol. 86, No. 8, (1998), pp. 1536-1551. (Pubitemid 128720262)
-
(1998)
Proceedings of the IEEE
, vol.86
, Issue.8
, pp. 1536-1551
-
-
Kovacs, G.T.A.1
Maluf, N.I.2
Petersen, K.E.3
-
14
-
-
0037566742
-
Frontiers of silicon-on-insulator
-
Celler, G.K., Cristoloveanu, S. Frontiers of silicon-on-insulator. Journal of Applied Physics, Vol. 93, No. 9, (2003), pp. 4955-4978.
-
(2003)
Journal of Applied Physics
, vol.93
, Issue.9
, pp. 4955-4978
-
-
Celler, G.K.1
Cristoloveanu, S.2
-
15
-
-
0023043012
-
Wafer bonding for silicon-on-insulator technologies
-
Lasky, J.B. Wafer bonding for silicon-on-insulator technologies. Appl. Phys. Lett., Vol. 48, (1986), pp. 78-80.
-
(1986)
Appl. Phys. Lett.
, vol.48
, pp. 78-80
-
-
Lasky, J.B.1
-
17
-
-
0344146578
-
Wafer bonding for microsystems technologies
-
Gösele, U., Tong, Q.Y., Schumacher, A., Kräuter, G., Reiche, M., Plößl, A., Kopperschmidt, P., Lee, T.-H., Kim, W.-J. Wafer bonding for microsystems technologies. Sensors and Actuators A, Vol. 74, (1999), pp. 161-168.
-
(1999)
Sensors and Actuators A
, vol.74
, pp. 161-168
-
-
Gösele, U.1
Tong, Q.Y.2
Schumacher, A.3
Kräuter, G.4
Reiche, M.5
Plößl, A.6
Kopperschmidt, P.7
Lee, T.-H.8
Kim, W.-J.9
-
18
-
-
0022721132
-
SILICON MICROCAVITIES FABRICATED WITH A NEW TECHNIQUE
-
Tenerz, L., Hök, E. Silicon microcavities fabricated with a new technique. Electron. Lett., 22, (1986), pp. 615-616. (Pubitemid 16570464)
-
(1986)
Electronics Letters
, vol.22
, Issue.11
, pp. 615-616
-
-
Tenerz, L.1
Hok, B.2
-
19
-
-
0024129796
-
Silicon Fusion Bonding for Pressure Sensors
-
Petersen, K., Barth, P., Poydock, J., Brown, J., Mallon, J., Bryzek, J. Silicon Fusion Bonding for Pressure Sensors. Tech Digest of IEEE Solid-State Sensor and Actuator Workshop. June, (1988), pp. 144-147.
-
Tech Digest of IEEE Solid-State Sensor and Actuator Workshop. June, (1988)
, pp. 144-147
-
-
Petersen, K.1
Barth, P.2
Poydock, J.3
Brown, J.4
Mallon, J.5
Bryzek, J.6
-
20
-
-
0038064679
-
Sealed-Cavity Microstructure Using Wafer Bonding Technology
-
th Int. Conf. Solid-State Sensors and Actuators, Transducers'93, (1993), pp. 274-277.
-
th Int. Conf. Solid-State Sensors and Actuators, Transducers'93, (1993)
, pp. 274-277
-
-
Parameswaran, L.1
McNeil, V.M.2
Huff, M.A.3
Schmidt, M.A.4
-
21
-
-
0030100650
-
Silicon fusion bonding and deep reactive ion etching: A new technology for microstructures
-
Klaassen, H., Petersen, K., Noworolski, J.M., Logan, J., Maluf, N.I., Brown, J., Storment, C., McCulley, W., Kovacs, G.T. Silicon Fusion Bonding and Deep Reactive Etching: A New Technology for Microstructures. Proc Transducers.95, Stockholm, Sweden, June 1995, 556, Sensors and Actuators A, 52, (1996), pp. 132-139. (Pubitemid 126346959)
-
(1996)
Sensors and Actuators, A: Physical
, vol.52
, Issue.1-3
, pp. 132-139
-
-
Klaassen, E.H.1
Petersen, K.2
Noworolski, J.M.3
Logan, J.4
Maluf, N.I.5
Brown, J.6
Storment, C.7
McCulley, W.8
Kovacs, G.T.A.9
-
22
-
-
0142164896
-
Method for anisotropic plasma etching of substrates
-
US Pat. 5 498 312, March 12
-
Laermer, F., Schilp, A. Method for anisotropic plasma etching of substrates. US Pat. 5 498 312, March 12, (1996).
-
(1996)
-
-
Laermer, F.1
Schilp, A.2
-
23
-
-
84884772999
-
-
German Patent DE 4241045
-
Lärmer, F., Schilp, A., German Patent DE 4241045.
-
-
-
Lärmer, F.1
Schilp, A.2
-
24
-
-
0029419192
-
Advanced silicon etching using high density plasma
-
Micromachining and Microfacrication Process Technology
-
Bhardwaj, J.K., Ashraf, H. Advanced silicon etching using high density plasma. Micromachining and Microfacrication Process Technology. SPIE Proceedings, Vol. 2639, (1995), pp. 224-233.
-
(1995)
SPIE Proceedings
, vol.2639
, pp. 224-233
-
-
Bhardwaj, J.K.1
Ashraf, H.2
-
26
-
-
0029350532
-
Bulk silicon microelectromechanical devices fabricated from commercial bonded and etched-back silicon-oninsulator substrates
-
Benitez A., Esteve, J., Bausells, J. Bulk silicon microelectromechanical devices fabricated from commercial bonded and etched-back silicon-oninsulator substrates. Sensors and Actuators A, (1995), pp. 99-103.
-
(1995)
Sensors and Actuators A
, pp. 99-103
-
-
Benitez, A.1
Esteve, J.2
Bausells, J.3
-
27
-
-
0000232061
-
Fabrication of nanoelectromechanical systems in single crystal silicon using silicon on insulator substrates and electron beam lithography
-
Carr D.W., Craighead, H.G. Fabrication of nanoelectromechanical systems in single crystal silicon using silicon on insulator substrates and electron beam lithography. J. Vac. Sci. Technol. B, Vol. 15, (1997), pp. 2760-2763. (Pubitemid 127585618)
-
(1997)
Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures
, vol.15
, Issue.6
, pp. 2760-2763
-
-
Carr, D.W.1
Craighead, H.G.2
-
28
-
-
84884796617
-
The Bosch Silicon Micromachining Foundry Service
-
Paper: T1A4. Available in
-
Gahn, C., Finkbeiner, S., Fürtsch, M., Kaschner, A., Offenberg, M. The Bosch Silicon Micromachining Foundry Service. Proceedings of the 16th European Conference on Solid-State Transducers (Eurosensors XVI), September 15-18, 2002, Prague, Czech Republic. Paper: T1A4. (2002). (Available in http://www.eurosensors.cz/fulltexts/gahn-2-4pages.pdf)
-
(2002)
Proceedings of the 16th European Conference on Solid-State Transducers (Eurosensors XVI), September 15-18, 2002, Prague, Czech Republic
-
-
Gahn, C.1
Finkbeiner, S.2
Fürtsch, M.3
Kaschner, A.4
Offenberg, M.5
-
29
-
-
0001622034
-
Milli-scale polysilicon structures
-
Keller, C., Ferrari, M. Milli-scale polysilicon structures. In: Tech. Dig. Solid-State Sensors Actuators Workshop, Hilton Head Island, SC, (1994), pp. 132-137.
-
Tech. Dig. Solid-State Sensors Actuators Workshop, Hilton Head Island, SC, (1994)
, pp. 132-137
-
-
Keller, C.1
Ferrari, M.2
-
30
-
-
0029489445
-
Hexsil bimorphs for vertical actuation
-
Keller, C.G., Howe, R.T. Hexsil bimorphs for vertical actuation. Proc. 8th Int. Conf. on Solid State Sensors and Actuators (Transducers '95) Stockholm, Sweden, June 25-29, (1995), pp. 99-102.
-
Proc. 8th Int. Conf. on Solid State Sensors and Actuators (Transducers '95) Stockholm, Sweden, June 25-29, (1995)
, pp. 99-102
-
-
Keller, C.G.1
Howe, R.T.2
-
31
-
-
0000832581
-
Process technology for the modular integration of CMOS and polysilicon microstructures
-
Bustillo, J.M., Fedder, G.K., Nguyen, C.T.-C., Howe, R.T. Process technology for the modular integration of CMOS and polysilicon microstructures. Microsyst. Technol., 1, (1994), pp. 30-41.
-
(1994)
Microsyst. Technol.
, vol.1
, pp. 30-41
-
-
Bustillo, J.M.1
Fedder, G.K.2
Nguyen, C.T.-C.3
Howe, R.T.4
-
32
-
-
0029489783
-
Embedded Micromechanical Devices for the Monolithic Integration of MEMS with CMOS
-
Smith, J.H., Montague, S., Sniegowski, J.J., Murray, J.R., McWhorter, P.J. Embedded Micromechanical Devices for the Monolithic Integration of MEMS with CMOS. Proc. 1995 International Electron Devices Meeting, IEDM'95, (1995), pp. 609-612.
-
Proc. 1995 International Electron Devices Meeting, IEDM'95, (1995)
, pp. 609-612
-
-
Smith, J.H.1
Montague, S.2
Sniegowski, J.J.3
Murray, J.R.4
McWhorter, P.J.5
-
33
-
-
0043065292
-
Modular process for integrating thick polysilicon MEMS devices with sub-micron CMOS
-
Yasaitis, J.A., Judy, M., Garone, P.M., Brosnihan, T., Pokrovskiy, N., Boser, B.E., Howe, R.T., Palaniapan, M. Modular process for integrating thick polysilicon MEMS devices with sub-micron CMOS. Proc. SPIE, Vol. 4979, (2003), pp. 145-154.
-
(2003)
Proc. SPIE
, vol.4979
, pp. 145-154
-
-
Yasaitis, J.A.1
Judy, M.2
Garone, P.M.3
Brosnihan, T.4
Pokrovskiy, N.5
Boser, B.E.6
Howe, R.T.7
Palaniapan, M.8
-
34
-
-
0009715506
-
'Cavity-Micromachining', Technology: Zero-Package Solution for Inertial Sensors
-
th International Conference on Solid-State Sensors and Actuators, Transducers 2001, Vol. 1, (2001), pp. 186-189.
-
(2001)
th International Conference on Solid-State Sensors and Actuators, Transducers 2001
, vol.1
, pp. 186-189
-
-
Aigner, R.1
Oppermann, K.-G.2
Kapels, H.3
Kolb, S.4
-
35
-
-
0026997981
-
Surface micromachined, digitally force-balanced accelerometer with integrated CMOS detection circuitry
-
Yun, W., Howe, R.T., Gray, P. Surface micromachined, digitally force-balanced accelerometer with integrated CMOS detection circuitry. Proc. of the IEEE Solid-State Sensor and Actuator Workshop '92, (1992), pp. 126-131.
-
Proc. of the IEEE Solid-State Sensor and Actuator Workshop '92, (1992)
, pp. 126-131
-
-
Yun, W.1
Howe, R.T.2
Gray, P.3
-
36
-
-
0002545171
-
Post-CMOS modular integration of poly-SiGe microstructures using poly-Ge sacrificial layers
-
Franke, A.E., Jiao, Y., Wu, M.T., King, T.-J., Howe, R.T. Post-CMOS modular integration of poly-SiGe microstructures using poly-Ge sacrificial layers. In: Solid-State Sensor and Actuator Workshop, Hilton Head, S.C, June, (2000), pp. 18-21.
-
Solid-State Sensor and Actuator Workshop, Hilton Head, S.C, June, (2000)
, pp. 18-21
-
-
Franke, A.E.1
Jiao, Y.2
Wu, M.T.3
King, T.-J.4
Howe, R.T.5
-
37
-
-
0037998356
-
CMOS compatibility of high aspect ratio micromachining (HARM) in bonded silicon on insulator
-
McNie, M.E., King, D.O. CMOS compatibility of high aspect ratio micromachining (HARM) in bonded silicon on insulator. Proc. SPIE, Vol. 3511, (1998), pp. 277-285.
-
(1998)
Proc. SPIE
, vol.3511
, pp. 277-285
-
-
McNie, M.E.1
King, D.O.2
-
38
-
-
0030233744
-
SCREAM MicroElectoMechanical Systems
-
MacDonald, N.C. SCREAM MicroElectoMechanical Systems. Microelectronics Engineering, 32, (1996), pp. 49-73.
-
(1996)
Microelectronics Engineering
, vol.32
, pp. 49-73
-
-
MacDonald, N.C.1
-
39
-
-
0028526888
-
A surface micromachined silicon accelerometer with on-chip detection circuitry
-
Kuehnel, W., Sherman, S. A surface micromachined silicon accelerometer with on-chip detection circuitry. Sensors and Actuators A, Vol. 45, (1994), pp. 7-16.
-
(1994)
Sensors and Actuators A
, vol.45
, pp. 7-16
-
-
Kuehnel, W.1
Sherman, S.2
-
40
-
-
84884761043
-
A 0.8μm CMOS Integrated Surface Micromachined Capacitive Pressure Sensor with EEPROM 181 Trimming and Digital Output for a Tire Pressure Monitoring System
-
Gogoi, B.P., Jo, S., August, R., McNeil, A., Fuhrmann, M., Torres, J., Miller, T.F., Reodique, A., Shaw, M., Neumann, K., Hughes, D. Jr., Monk, D.J. A 0.8μm CMOS Integrated Surface Micromachined Capacitive Pressure Sensor with EEPROM 181 Trimming and Digital Output for a Tire Pressure Monitoring System. Solid-State Sensor, Actuator and Microsystem Workshop, Hilton Head Island, South Carolina June 2-6, (2002), pp. 181-184.
-
Solid-State Sensor, Actuator and Microsystem Workshop, Hilton Head Island, South Carolina June 2-6, (2002)
, pp. 181-184
-
-
Gogoi, B.P.1
Jo, S.2
August, R.3
McNeil, A.4
Fuhrmann, M.5
Torres, J.6
Miller, T.F.7
Reodique, A.8
Shaw, M.9
Neumann, K.10
Hughes Jr., D.11
Monk, D.J.12
-
41
-
-
0006273809
-
A low-noise digital accelerometer using integrated SOI-MEMS technology
-
Lemkin, M.A., Juneau, T.N., Clark, W.A., Roessig, T.A., Brosnihan, T.J. A low-noise digital accelerometer using integrated SOI-MEMS technology. Transducers '99, (1999), pp. 1294-1297.
-
(1999)
Transducers '99
, pp. 1294-1297
-
-
Lemkin, M.A.1
Juneau, T.N.2
Clark, W.A.3
Roessig, T.A.4
Brosnihan, T.J.5
-
42
-
-
17644440273
-
Integrated Sensor and Electronics Processing for >10∧8 "iMEMS" Inertial Measurement Unit Components
-
Lewis, S., Alie, S., Brosnihan, T., Core, C., Core, T., Howe, R., Geen, J., Holloher, D., Judy, M., Memishan, J., Nunan K., Paine, R., Sherman, S., Tsang, B., Wachtmann, B. Integrated Sensor and Electronics Processing for >10∧8 "iMEMS" Inertial Measurement Unit Components. Technical Digests of International Electron Devices Meeting 2003, IEDM'03, (2003), pp. 949-952.
-
Technical Digests of International Electron Devices Meeting 2003, IEDM'03, (2003)
, pp. 949-952
-
-
Lewis, S.1
Alie, S.2
Brosnihan, T.3
Core, C.4
Core, T.5
Howe, R.6
Geen, J.7
Holloher, D.8
Judy, M.9
Memishan, J.10
Nunan, K.11
Paine, R.12
Sherman, S.13
Tsang, B.14
Wachtmann, B.15
-
43
-
-
0032595024
-
A merged Process for Thick Single-Crystal Si Resonators and BiCMOS Circuitry
-
Weigold, J.W., Wong, A.-C., Nguyen, C.T.-C., Pang, S.W. A merged Process for Thick Single-Crystal Si Resonators and BiCMOS Circuitry. J. Microelectromechanical Systems, Vol. 8, (1999), pp. 221-228.
-
(1999)
J. Microelectromechanical Systems
, vol.8
, pp. 221-228
-
-
Weigold, J.W.1
Wong, A.-C.2
Nguyen, C.T.-C.3
Pang, S.W.4
-
44
-
-
0027814761
-
2 256 Mb trench DRAM cell with self-aligned BuriEd STrap (BEST)
-
2 256 Mb trench DRAM cell with self-aligned BuriEd STrap (BEST). Technical Digest of International Electron Devices Meeting 1993, IEDM'93, (1993), pp. 627-630.
-
Technical Digest of International Electron Devices Meeting 1993, IEDM'93, (1993)
, pp. 627-630
-
-
Nesbit, L.1
Alsmeier, J.2
Chen, B.3
DeBrosse, J.4
Faheyk, P.5
Gall, M.6
Gambino, J.7
Gernhard, S.8
Ishiuchi, H.9
Kleinhenz, R.10
Mandelman, J.11
Mii, T.12
Morikado, M.13
Nitayama, A.14
Parke, S.15
Wong, H.16
Bronner, G.17
-
46
-
-
0008600390
-
Etching processes for high aspect ratio micro systems technology (HARMST)
-
Kassing, R., Rangelow, I.W. Etching processes for high aspect ratio microsystems technology (HARMST). Microsystems Technologies, Vol. 3, (1996), pp. 20-27. (Pubitemid 126479095)
-
(1996)
Microsystem Technologies
, vol.3
, Issue.1
, pp. 20-27
-
-
Kassing, R.1
Rangelow, I.W.2
-
47
-
-
0029224537
-
Deep and fast plasma etching for silicon micromachining
-
Francou, M., Daniel, J.S., Peccoud, L. Deep and fast plasma etching for silicon micromachining. Sensors and Actuators A46-47, (1995), pp. 17-21.
-
(1995)
Sensors and Actuators
, vol.A46-47
, pp. 17-21
-
-
Francou, M.1
Daniel, J.S.2
Peccoud, L.3
-
48
-
-
65949104489
-
High-aspect ratio Si etching for microsensor fabrication
-
Juan, W.H., Pang, S.W. High-aspect ratio Si etching for microsensor fabrication. J. Vac. Sci. Technol., A 13, (1995), pp. 834-838.
-
(1995)
J. Vac. Sci. Technol.
, vol.A 13
, pp. 834-838
-
-
Juan, W.H.1
Pang, S.W.2
-
49
-
-
0029277715
-
High rate directional deep dry etching for bulk silicon micromachining
-
Esashi, M., Takinami, M., Wakabayashi, Y., Minami, K. High rate directional deep dry etching for bulk silicon micromachining. J. Micromech. Microeng, (1995), pp. 5-10.
-
(1995)
J. Micromech. Microeng.
, pp. 5-10
-
-
Esashi, M.1
Takinami, M.2
Wakabayashi, Y.3
Minami, K.4
-
50
-
-
0034850698
-
Comparison of Bosch and cryogenic processes for patterning high aspect ratio features in silicon
-
DOI 10.1117/12.425288
-
Walker, M.J. Comparison of Bosch and cryogenic processes for patterning high-aspect-ratio features in silicon. Proc. of SPIE, Vol. 4407, (2001), pp. 89-99. (Pubitemid 32833674)
-
(2001)
Proceedings of SPIE - The International Society for Optical Engineering
, vol.4407
, pp. 89-99
-
-
Walker, M.J.1
-
51
-
-
0001041427
-
Reactive ion etching for micromechanical systems fabrication
-
Rangelow, I.W., Löschner, H. Reactive ion etching for micromechanical systems fabrication. J. Vac. Sci. Technol., B 13 (1995), pp. 2394-2399.
-
(1995)
J. Vac. Sci. Technol.
, vol.B 13
, pp. 2394-2399
-
-
Rangelow, I.W.1
Löschner, H.2
-
52
-
-
0006790133
-
Etching through silicon wafer in inductively coupled plasma
-
Franssila, S., Kiihamäki, J., Karttunen, J. Etching through silicon wafer in inductively coupled plasma. Microsystem Technologies, Vol. 6, (2000), pp. 141-144.
-
(2000)
Microsystem Technologies
, vol.6
, pp. 141-144
-
-
Franssila, S.1
Kiihamäki, J.2
Karttunen, J.3
-
53
-
-
0032753082
-
Characterization of a Time Multiplexed Inductively Coupled Plasma Etcher
-
Ayón, A., Braff, R., Lin, C.C., Sawin, H.H., Schmidt, M.A.J. Characterization of a Time Multiplexed Inductively Coupled Plasma Etcher. Electrochem. Soc., Vol. 146, (1999), pp. 339-349.
-
(1999)
Electrochem. Soc.
, vol.146
, pp. 339-349
-
-
Ayón, A.1
Braff, R.2
Lin, C.C.3
Sawin, H.H.4
Schmidt, M.A.J.5
-
54
-
-
0142087216
-
Influence of Coil Power on the Etching Characteristics in a High Density Plasma Etcher
-
Ayón, A., Braff, R., Bayt, R., Sawin, H.H., Schmidt, M.A. Influence of Coil Power on the Etching Characteristics in a High Density Plasma Etcher. J. Electrochem. Soc., Vol. 146, (1999), pp. 2730-2736.
-
(1999)
J. Electrochem. Soc.
, vol.146
, pp. 2730-2736
-
-
Ayón, A.1
Braff, R.2
Bayt, R.3
Sawin, H.H.4
Schmidt, M.A.5
-
55
-
-
0002730357
-
Etching Characteristics and Profile Control in a Time Multiplexed Inductively Coupled Plasma Etcher
-
Ayón, A., Braff, R., Lin, C.C., Sawin, H.H. Etching Characteristics and Profile Control in a Time Multiplexed Inductively Coupled Plasma Etcher. Sensors and Actuators Workshop, 1998 Hilton Head, (1998), pp. 41-44.
-
Sensors and Actuators Workshop, 1998 Hilton Head, (1998)
, pp. 41-44
-
-
Ayón, A.1
Braff, R.2
Lin, C.C.3
Sawin, H.H.4
-
56
-
-
0042340423
-
Deep silicon etching in inductively coupled plasma reactor for mems
-
Kiihamäki, J., Franssila, S. Deep silicon etching in inductively coupled plasma reactor for mems. Physica Scripta, Vol. T79, (1999), pp. 250-254.
-
(1999)
Physica Scripta
, vol.T79
, pp. 250-254
-
-
Kiihamäki, J.1
Franssila, S.2
-
57
-
-
0031072583
-
RIE lag in high aspect ratio trench etching of silicon
-
PII S0167931796001426
-
Jansen, H., de Boer, M., Wiegerink, R., Tas, N., Smulders, E., Neagu, C., Elwenspoek, M. RIE lag in high aspect ratio trench etching of silicon. Microelectronic Engineering, 35, (1997), pp. 45-50. (Pubitemid 127367082)
-
(1997)
Microelectronic Engineering
, vol.35
, Issue.1-4
, pp. 45-50
-
-
Jansen, H.1
De Boer, M.2
Wiegerink, R.3
Tas, N.4
Smulders, E.5
Neagu, C.6
Elwenspoek, M.7
-
58
-
-
0022092551
-
STRUCTURAL EFFECTS ON A SUBMICRON TRENCH PROCESS
-
Chin, D., Dhong, S.H., Long, G.J. Structural Effects on a submicron Trench Process. J. Electrochem. Soc., 132, (1985), pp. 1705-1707. (Pubitemid 15507964)
-
(1985)
Journal of the Electrochemical Society
, vol.132
, Issue.7
, pp. 1705-1707
-
-
Chin, D.1
Dhong, S.H.2
Long, G.J.3
-
59
-
-
0026204736
-
Feature-Size Dependence of Etch Rate in Reactive Ion Etching
-
Lee, Y.H., Zhou, Z.H. Feature-Size Dependence of Etch Rate in Reactive Ion Etching. J. Electrochem. Soc. 138, (1991), pp. 2439-2445.
-
(1991)
J. Electrochem. Soc.
, vol.138
, pp. 2439-2445
-
-
Lee, Y.H.1
Zhou, Z.H.2
-
60
-
-
0001197855
-
Microscopic uniformity in plasma etching
-
Gottscho, R.A., Jurgensen, C.W., Vitkavage, D.J. Microscopic uniformity in plasma etching. J. Vac. Sci. Technol., B 10, (1992), pp. 2133-2147.
-
(1992)
J. Vac. Sci. Technol.
, vol.B 10
, pp. 2133-2147
-
-
Gottscho, R.A.1
Jurgensen, C.W.2
Vitkavage, D.J.3
-
61
-
-
36549100677
-
Conductance considerations in the reactive ion etching of high aspect ratio features
-
Coburn, J.W., Winters, H.F. Conductance considerations in the reactive ion etching of high aspect ratio features. Appl. Phys. Lett., 55, (1989), pp. 2730-2732.
-
(1989)
Appl. Phys. Lett.
, vol.55
, pp. 2730-2732
-
-
Coburn, J.W.1
Winters, H.F.2
-
62
-
-
33645340155
-
Pattern shape effects and artefacts in deep silicon etching
-
Kiihamäki, J., Franssila, S. Pattern shape effects and artefacts in deep silicon etching. J. Vac. Sci. Technol. A. Vacuum, Vol. 17, (1999), pp. 2280-2285.
-
(1999)
J. Vac. Sci. Technol. A. Vacuum
, vol.17
, pp. 2280-2285
-
-
Kiihamäki, J.1
Franssila, S.2
-
63
-
-
0029253905
-
Selectivity and Si-load in deep trench etching
-
Muller, K.P., Roithner, K., Timme, H.-J. Selectivity and Si-load in deep trench etching. Microeletronic Engineering, 27, (1995), pp. 457-462.
-
(1995)
Microeletronic Engineering
, vol.27
, pp. 457-462
-
-
Muller, K.P.1
Roithner, K.2
Timme, H.-J.3
-
64
-
-
0034318140
-
Kinetics and crystal orientation dependence in high aspect ratio silicon dry etching
-
DOI 10.1116/1.1313578
-
Blauw, M.A., Zijlstra, T., Bakker, R.A., van der Drift, E. Kinetics and crystal orientation dependence in high aspect ratio silicon dry etching. J. Vac. Sci. Technol., B 18, (2000), pp. 3453-3461. (Pubitemid 32088234)
-
(2000)
Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures
, vol.18
, Issue.6
, pp. 3453-3461
-
-
Blauw, M.A.1
Zijlstra, T.2
Bakker, R.A.3
Van Der, D.E.4
-
65
-
-
0004195769
-
-
2nd ed. John Wiley, and Sons, Inc., New York
-
O'Hanlon, J.F. A user's guide to vacuum technology. 2nd ed. John Wiley, and Sons, Inc., New York, (1989), pp. 438-439.
-
(1989)
A User's Guide to Vacuum Technology
, pp. 438-439
-
-
O'Hanlon, J.F.1
-
66
-
-
0038697336
-
The influence of reactant transport on the profiles of gas chopping etching processes: A simulation approach
-
Volland, B.E., Rangelow, I.W. The influence of reactant transport on the profiles of gas chopping etching processes: a simulation approach. Microelectronic Engineering, Vol. 67-68, (2003), pp. 338-348.
-
(2003)
Microelectronic Engineering
, vol.67-68
, pp. 338-348
-
-
Volland, B.E.1
Rangelow, I.W.2
-
67
-
-
0034507043
-
A novel Integrated MEMS Process Using Fluorocarbon Films Deposited with a Deep Reactive Ion Etching (DRIE) Tool
-
Ayón A.A., Chen, D.-Z., Kanna, R., Braff, R., Sawin, H.H., Schmidt, M.A. A novel Integrated MEMS Process Using Fluorocarbon Films Deposited with a Deep Reactive Ion Etching (DRIE) Tool. Proc. of the MRS Symposium, Vol. 605, (1999), pp. 141-147.
-
(1999)
Proc. of the MRS Symposium
, vol.605
, pp. 141-147
-
-
Ayón, A.A.1
Chen, D.-Z.2
Kanna, R.3
Braff, R.4
Sawin, H.H.5
Schmidt, M.A.6
-
68
-
-
0035519156
-
Balancing the etching and passivation in time-multiplexed deep dry etching of silicon
-
DOI 10.1116/1.1415511, 45th International COnference on Electron, Ion, and Photon Beam Technology and Nanofabrication
-
Blauw, M.A., Zijlstra, T., van der Drift, E. Balancing the etching and passivation in time-multiplexed deep dry etching of silicon. J. Vac. Sci. Technol., B 19, (2001), pp. 2930-2934. (Pubitemid 34089857)
-
(2001)
Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures
, vol.19
, Issue.6
, pp. 2930-2934
-
-
Blauw, M.A.1
Zijlstra, T.2
Van Der, D.E.3
-
69
-
-
0032674784
-
Recent advances in silicon etching for MEMS using the ASE™ process
-
Hynes, A.M., Ashraf, H., Bhardwaj, J.K., Hopkins, J., Johnston, I., Shepherd, J.N. Recent advances in silicon etching for MEMS using the ASE™ process. Sensors and Actuators A, Vol. 74, (1999), pp. 13-17.
-
(1999)
Sensors and Actuators A
, vol.74
, pp. 13-17
-
-
Hynes, A.M.1
Ashraf, H.2
Bhardwaj, J.K.3
Hopkins, J.4
Johnston, I.5
Shepherd, J.N.6
-
70
-
-
0033324414
-
The Benefits of Process Parameter Ramping During the Plasma Etching of High Aspect Ratio Silicon Structures
-
Material Research Society
-
Hopkins, J., Ashraf, H., Bhardwaj, J.K., Hynes, A.M., Johnston, I., Shepherd, J.N. The Benefits of Process Parameter Ramping During the Plasma Etching of High Aspect Ratio Silicon Structures. Mat. Res. Soc. Symp. Proc., Vol. 546, Material Research Society, (1999). Pp. 63-68.
-
(1999)
Mat. Res. Soc. Symp. Proc.
, vol.546
, pp. 63-68
-
-
Hopkins, J.1
Ashraf, H.2
Bhardwaj, J.K.3
Hynes, A.M.4
Johnston, I.5
Shepherd, J.N.6
-
71
-
-
0038105122
-
Infra.red interference patterns for new capabilities in Laser End Point detection
-
Heason, D.J., Spencer, A.G. Infra.red interference patterns for new capabilities in Laser End Point detection. J. Phys. D: Appl. Phys., 36, (2003), pp. 1543-1549.
-
(2003)
J. Phys. D: Appl. Phys.
, vol.36
, pp. 1543-1549
-
-
Heason, D.J.1
Spencer, A.G.2
-
72
-
-
0029293788
-
Aspect Ratio Independent Etching: Fact or Fantasy?
-
Bailey, A.D. III, Gottscho, R.A. Aspect Ratio Independent Etching: Fact or Fantasy? Jpn. J. Appl. Phys., Vol. 34, (1995), pp. 2083-2088.
-
(1995)
Jpn. J. Appl. Phys.
, vol.34
, pp. 2083-2088
-
-
Bailey III, A.D.1
Gottscho, R.A.2
-
73
-
-
2342464265
-
Geometrical pattern effect on silicon deep etching by an inductively coupled plasma system
-
Chung, C.K. Geometrical pattern effect on silicon deep etching by an inductively coupled plasma system. J. Micromech. Microeng., 14, (2004), pp. 656-662.
-
(2004)
J. Micromech. Microeng.
, vol.14
, pp. 656-662
-
-
Chung, C.K.1
-
74
-
-
0017526342
-
The Loading Effect in Plasma Etching
-
Mogab, C.J. The Loading Effect in Plasma Etching. J. Electrochem. Soc., Vol. 124, (1977), pp. 1262-1268.
-
(1977)
J. Electrochem. Soc.
, vol.124
, pp. 1262-1268
-
-
Mogab, C.J.1
-
75
-
-
2142769904
-
Characterization of the Microloading Effect in Deep Reactive Ion Etching of Silicon
-
Jensen, S., Hansen, O. Characterization of the Microloading Effect in Deep Reactive Ion Etching of Silicon. Proc. SPIE, Vol. 5342, (2004), pp. 111-118.
-
(2004)
Proc. SPIE
, vol.5342
, pp. 111-118
-
-
Jensen, S.1
Hansen, O.2
-
76
-
-
0034856893
-
Characterisation and optimisation of deep dry etching for MEMS applications
-
DOI 10.1117/12.425287
-
Rickard, A., McNie, M. Characterization and optimisation of deep dry etching for MEMS applications. Proc. SPIE, Vol. 4407, (2001), pp. 78-88. (Pubitemid 32833673)
-
(2001)
Proceedings of SPIE - The International Society for Optical Engineering
, vol.4407
, pp. 78-88
-
-
Rickard, A.1
McNie, M.2
-
77
-
-
33646018305
-
Inverse Microloading Effect in Reactive Ion Etching of Silicon
-
Jensen, S., Hansen, O. Inverse Microloading Effect in Reactive Ion Etching of Silicon. Proceedings of the International Symposium on Plasma Processing XIV, Philadelphia, PA, USA, May, (2002), pp. 218-226.
-
Proceedings of the International Symposium on Plasma Processing XIV, Philadelphia, PA, USA, May, (2002)
, pp. 218-226
-
-
Jensen, S.1
Hansen, O.2
-
78
-
-
84957351822
-
Microloading effect in reactive ion etching
-
Hedlund, C., Blom, H.-O., Berg, S. Microloading effect in reactive ion etching. J. Vac. Sci. Technol., A 12, (1994), pp. 1962-1965.
-
(1994)
J. Vac. Sci. Technol.
, vol.A 12
, pp. 1962-1965
-
-
Hedlund, C.1
Blom, H.-O.2
Berg, S.3
-
79
-
-
0342906553
-
Depth and profile control in plasma etched MEMS structures
-
Kiihamäki, J., Kattelus, H., Karttunen, J., Franssila, S. Depth and profile control in plasma etched MEMS structures. Sensors and Actuators A, Vol. 82, (2000), pp. 234-238.
-
(2000)
Sensors and Actuators A
, vol.82
, pp. 234-238
-
-
Kiihamäki, J.1
Kattelus, H.2
Karttunen, J.3
Franssila, S.4
-
80
-
-
0346651219
-
Charging of pattern features during plasma etching
-
Arnold, J.C., Sawin, H.H. Charging of pattern features during plasma etching. J. Appl. Phys, 70, (1991), pp. 5314-5317.
-
(1991)
J. Appl. Phys
, vol.70
, pp. 5314-5317
-
-
Arnold, J.C.1
Sawin, H.H.2
-
81
-
-
0000830374
-
On the origin of the notching effect during etching in uniform high density plasmas
-
Hwang, G.S., Giapis, K.P. On the origin of the notching effect during etching in uniform high density plasmas. J. Vac. Sci. Technol., B 15(1), (1997), pp. 70-87. (Pubitemid 127574172)
-
(1997)
Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures
, vol.15
, Issue.1
, pp. 70-87
-
-
Hwang, G.S.1
Giapis, K.P.2
-
82
-
-
4244204041
-
Method and apparatus for etching a substrate
-
US Patent 6187685
-
Hopkins, J., Johnston, I.R., Bhardwaj, J.K., Ashraf, H., Hynes, A.M., Lea, L.M. Method and apparatus for etching a substrate. US Patent 6187685, (2001).
-
(2001)
-
-
Hopkins, J.1
Johnston, I.R.2
Bhardwaj, J.K.3
Ashraf, H.4
Hynes, A.M.5
Lea, L.M.6
-
83
-
-
84884784098
-
-
Project No. IST-1999-20387, dissemination office
-
Project "Microspect", Final Dissemination Report, Project No. IST-1999-20387, 2003. (SEA dissemination office, http://www.sea.rl.ac.uk)
-
(2003)
Project "Microspect", Final Dissemination Report
-
-
-
84
-
-
0042732917
-
Performance enhancement and evaluation of deep dry etching on a production cluster platform
-
McNie, M., Pickering, C., Rickard, A., Young, I.J. Hopkins, J., Ashraf, H., McAuley, S., Nicholls, G., Barnett, R., Roozeboom, F., Kemmeren, A., Heuvel, E., van den Verhoeven, J., Gormley, C., Schina, P., Luciano, C.Di, Kiihamäki, J. Performance enhancement and evaluation of deep dry etching on a production cluster platform. Proc. SPIE, Vol. 4979, (2003), pp. 34-42.
-
(2003)
Proc. SPIE
, vol.4979
, pp. 34-42
-
-
McNie, M.1
Pickering, C.2
Rickard, A.3
Young, I.J.4
Hopkins, J.5
Ashraf, H.6
McAuley, S.7
Nicholls, G.8
Barnett, R.9
Roozeboom, F.10
Kemmeren, A.11
Heuvel, E.12
Van Den Verhoeven, J.13
Gormley, C.14
Schina, P.15
Di Luciano, C.16
Kiihamäki, J.17
-
85
-
-
0042841359
-
Application of the footing effect in the micromachining of self-aligned, free-standing, complimentary metal.oxide.semiconductor compatible structures
-
Ayón, A., Ishihara, K., Braff, R.A., Sawin, H.H., Schmidt, M.A. Application of the footing effect in the micromachining of self-aligned, free-standing, complimentary metal.oxide.semiconductor compatible structures. J. Vac. Sci. Technol., A 17(4), (1999), pp. 2274-2279.
-
(1999)
J. Vac. Sci. Technol.
, vol.A 17
, Issue.4
, pp. 2274-2279
-
-
Ayón, A.1
Ishihara, K.2
Braff, R.A.3
Sawin, H.H.4
Schmidt, M.A.5
-
86
-
-
0141495411
-
A dry single-step process for the manufacture of released MEMS structures
-
Docker, P.T., Kinnell, P., Ward, M.C.L. A dry single-step process for the manufacture of released MEMS structures. J. Micromech. Microeng., 13, (2003), pp. 790-794.
-
(2003)
J. Micromech. Microeng.
, vol.13
, pp. 790-794
-
-
Docker, P.T.1
Kinnell, P.2
Ward, M.C.L.3
-
87
-
-
0038329685
-
Advanced etch tool for high etch rate deep reactive ion etching in silicon micromachining production environment
-
Schilp, A., Hausner, M., Puech, M., Launay, N., Karagoezoglu, H., Laermer, F. Advanced etch tool for high etch rate deep reactive ion etching in silicon micromachining production environment. Proceedings of Microsystem Technologies 2001, Dusseldorf, (2001), pp. 425-430.
-
Proceedings of Microsystem Technologies 2001, Dusseldorf, (2001)
, pp. 425-430
-
-
Schilp, A.1
Hausner, M.2
Puech, M.3
Launay, N.4
Karagoezoglu, H.5
Laermer, F.6
-
88
-
-
0033725630
-
Atomic fluorine beam etching of silicon and related materials
-
Larson, P.R., Copeland, K.A., Dharmasena, G., Lasell, R.A., Keil, M., Johnson, M.B. Atomic fluorine beam etching of silicon and related materials. J. Vac. Sci Technol. B, Vol. 18, (2000), pp. 307-312.
-
(2000)
J. Vac. Sci Technol. B
, vol.18
, pp. 307-312
-
-
Larson, P.R.1
Copeland, K.A.2
Dharmasena, G.3
Lasell, R.A.4
Keil, M.5
Johnson, M.B.6
-
91
-
-
0032636316
-
Three-axis SOI capacitive accelerometer with PLL C-V converter
-
Matsumoto, Y., Nishimura, M., Matsuura, M., Ishida, M. Three-axis SOI capacitive accelerometer with PLL C-V converter. Sensors and Actuators A: Physical, Vol. 75, (1999), pp. 77-85.
-
(1999)
Sensors and Actuators A: Physical
, vol.75
, pp. 77-85
-
-
Matsumoto, Y.1
Nishimura, M.2
Matsuura, M.3
Ishida, M.4
-
92
-
-
0032714562
-
Novel prevention method of stiction using silicon anodization for SOI structure
-
Matsumoto, Y., Shimada, T., Ishida, M. Novel prevention method of stiction using silicon anodization for SOI structure. Sensors and Actuators A, Vol. 72, (1999), pp. 153-159.
-
(1999)
Sensors and Actuators A
, vol.72
, pp. 153-159
-
-
Matsumoto, Y.1
Shimada, T.2
Ishida, M.3
-
93
-
-
0032667595
-
MEMS fabrication of high aspect ratio track-following microactuator for hard disk drive using silicon on insulator
-
Kim, B.-H., Park, S., Kim, H.C., Chun, K., Cho D.-I.D., Lee, J.-W., Lee, H.-J., Kim, S.-H., Seong, W.-K., An, Y.-J. MEMS fabrication of high aspect ratio track-following microactuator for hard disk drive using silicon on insulator. Twelfth IEEE International Conference on Micro Electro Mechanical Systems, MEMS '99, 17-21 Jan. (1999), pp. 53-56.
-
Twelfth IEEE International Conference on Micro Electro Mechanical Systems, MEMS '99, 17-21 Jan. (1999)
, pp. 53-56
-
-
Kim, B.-H.1
Park, S.2
Kim, H.C.3
Chun, K.4
Cho, D.-I.D.5
Lee, J.-W.6
Lee, H.-J.7
Kim, S.-H.8
Seong, W.-K.9
An, Y.-J.10
-
94
-
-
84884780343
-
Behaviour of aluminum in ozonated water, optical and electrochemical study
-
Electrochemical Society. Pennington
-
Ritala, H., Pehkonen, A., Solehmainen, K., Grönberg, L. Behaviour of aluminum in ozonated water, optical and electrochemical study. Proc. 8th Intern. Symp. Cleaning Technol. in Semicond. Dev. Manufacturing PV 2003-26, Orlando, USA, 11-15 Oct 2003. Electrochemical Society. Pennington (2004), pp. 405-412.
-
(2004)
Proc. 8th Intern. Symp. Cleaning Technol. in Semicond. Dev. Manufacturing PV 2003-26, Orlando, USA, 11-15 Oct 2003
, pp. 405-412
-
-
Ritala, H.1
Pehkonen, A.2
Solehmainen, K.3
Grönberg, L.4
-
95
-
-
39549099282
-
Oxidation of aluminum in ozonated water
-
DOI 10.1088/0031-8949/2004/T114/059, Proceedings of the 20th Nordic Semiconductor Meeting (NSM20)
-
Ritala, H., Solehmainen, K., Grönberg, L. Oxidation of aluminum in ozonated water. Physica Scripta, Vol. T114, (2004), pp. 233-235. (Pubitemid 351280231)
-
(2004)
Physica Scripta T
, vol.T114
, pp. 233-235
-
-
Ritala, H.1
Solehmainen, K.2
Gronberg, L.3
-
96
-
-
3042697903
-
Characterization of bonded interface by HF etching method
-
The Electrochemical Society. Paris
-
Suni, T., Kiihamäki, J., Henttinen, K., Suni, I., Mäkinen, J. Characterization of bonded interface by HF etching method. Electrochemical Society Spring Meeting 2003, Semiconductor Wafer Bonding VII: Science, Technology, and Applications PV2003-19, Paris, FR, April 28 - May 5, 2003. The Electrochemical Society. Paris, (2003), pp. 70-75.
-
(2003)
Electrochemical Society Spring Meeting 2003, Semiconductor Wafer Bonding VII: Science, Technology, and Applications PV2003-19, Paris, FR, April 28 - May 5, 2003
, pp. 70-75
-
-
Suni, T.1
Kiihamäki, J.2
Henttinen, K.3
Suni, I.4
Mäkinen, J.5
-
97
-
-
0028425011
-
Stiction of surface micromachined structures after rinsing and drying: Model and investigation of adhesion mechanisms
-
Legtenberg, R., Tilmans, H.A.C., Elders, J., Elwenspoek, M. Stiction of surface micromachined structures after rinsing and drying: model and investigation of adhesion mechanisms. Sensors and Actuators A, Vol.43, (1994), pp. 230-238.
-
(1994)
Sensors and Actuators A
, vol.43
, pp. 230-238
-
-
Legtenberg, R.1
Tilmans, H.A.C.2
Elders, J.3
Elwenspoek, M.4
-
98
-
-
85008009310
-
Supercritical Carbon Dioxide Drying Of Microstructures
-
Mulhern, G.T., Sloane, D.S., Howe, R.T. Supercritical Carbon Dioxide Drying Of Microstructures. Digest of Technical Papers - The 7th International Conference on Solid-State Sensors and Actuators (Transducers '93), (1993), pp. 296-299.
-
Digest of Technical Papers - The 7th International Conference on Solid-State Sensors and Actuators (Transducers '93), (1993)
, pp. 296-299
-
-
Mulhern, G.T.1
Sloane, D.S.2
Howe, R.T.3
-
99
-
-
0031648044
-
Comparative evaluation of drying techniques for surface-micromachining
-
Kim, C.-J, Kim, J.Y., Sridharan, B. Comparative evaluation of drying techniques for surface-micromachining. Sensors and Actuators A, Vol. 64, (1988), pp. 17-26.
-
(1988)
Sensors and Actuators A
, vol.64
, pp. 17-26
-
-
Kim, C.-J.1
Kim, J.Y.2
Sridharan, B.3
-
100
-
-
10844230412
-
Flash release - An alternative for releasing complex MEMS devices
-
DOI 10.1088/0960-1317/14/12/009, PII S0960131704816796
-
Deladi, S., Svetovoy, V., Krijnen, G.J.M., Elwenspoek, M.C. Flash release - an alternative for releasing complex MEMS devices. J. Micromech. Microeng., 14, (2004), pp. 1659-1664. (Pubitemid 40002287)
-
(2004)
Journal of Micromechanics and Microengineering
, vol.14
, Issue.12
, pp. 1659-1664
-
-
Deladi, S.1
Svetovoy, V.2
Krijnen, G.J.M.3
Elwenspoek, M.C.4
-
101
-
-
0031235607
-
Dry release for surface micromachining with HF vapor-phase etching
-
PII S1057715797046015
-
Lee, Y.-I., Park, K.-H., Lee, J., Lee C.-H., Yoo, H.J., Kim, C.J., Yoon, Y.S. Dry Release for surface Micromachining with HF Vapor-Phase Etching. J. of Microelectromechanical Systems, Vol. 6, No. 3, (1997), pp. 226-233. (Pubitemid 127603950)
-
(1997)
Journal of Microelectromechanical Systems
, vol.6
, Issue.3
, pp. 226-233
-
-
Lee, Y.-I.1
Park, K.-H.2
Lee, J.3
Lee, C.-S.4
Yoo, H.J.5
Kim, C.-J.6
Yoon, Y.-S.7
-
102
-
-
84945975075
-
'Plug-Up' - A new concept for fabricating SOI MEMS devices
-
Institute of Electrical and Electronics Engineers. France
-
Kiihamäki, J., Pekko, P., Kattelus, H., Sillanpää, T., Mattila, T. 'Plug-Up' - A new concept for fabricating SOI MEMS devices. Proceedings 5th Symposium on Design Test, Integration and Packaging of MEMS/MOEMS, 5-7 May 2003, Institute of Electrical and Electronics Engineers. France, (2003), pp. 229-233.
-
(2003)
Proceedings 5th Symposium on Design Test, Integration and Packaging of MEMS/MOEMS, 5-7 May 2003
, pp. 229-233
-
-
Kiihamäki, J.1
Pekko, P.2
Kattelus, H.3
Sillanpää, T.4
Mattila, T.5
-
103
-
-
0036995286
-
A novel method for processing capacitive micromechanical ultrasonic transducers (cMUT)
-
Saarilahti, J., Blomberg, M., Häärä, A., Kattelus, H. A novel method for processing capacitive micromechanical ultrasonic transducers (cMUT). Proc. IEEE Ultrasonics Symposium. 2002, Vol.2, (2002), pp. 1071-1074.
-
(2002)
Proc. IEEE Ultrasonics Symposium. 2002
, vol.2
, pp. 1071-1074
-
-
Saarilahti, J.1
Blomberg, M.2
Häärä, A.3
Kattelus, H.4
-
104
-
-
0032678755
-
Vacuum encapsulation of resonant devices using permeable polysilicon
-
Lebouitz, K.S., Mazaheri, A., Howe, R.T., Pisano, A.P. Vacuum encapsulation of resonant devices using permeable polysilicon. Technical Digest, 12th Int. IEEE MEMS Conf., Orlando, Florida, Jan. 17-21, (1999), pp. 470-475.
-
Technical Digest, 12th Int. IEEE MEMS Conf., Orlando, Florida, Jan. 17-21, (1999)
, pp. 470-475
-
-
Lebouitz, K.S.1
Mazaheri, A.2
Howe, R.T.3
Pisano, A.P.4
-
105
-
-
0030348907
-
Microfabricated ultrasonic transducers: Towards robust models and immersion devices
-
Ladabaum I., Jin, X., Soh, H.T., Pierre, F., Atalar, A., Khuri-Yakub, B.T. Microfabricated ultrasonic transducers: towards robust models and immersion devices. IEEE Ultrasonics Symposium Proceedings 1996, Vol. 1, (1996), pp. 335-338.
-
(1996)
IEEE Ultrasonics Symposium Proceedings 1996
, vol.1
, pp. 335-338
-
-
Ladabaum, I.1
Jin, X.2
Soh, H.T.3
Pierre, F.4
Atalar, A.5
Khuri-Yakub, B.T.6
-
106
-
-
0029510931
-
Permeable Polysilicon Etch-Access Windows for Microshell Fabrication
-
Lebouitz, K.S. Howe, R.T., Pisano, A.P. Permeable Polysilicon Etch-Access Windows for Microshell Fabrication. Technical Digest of Transducers '95, Stockholm, Sweden, June 25-029, (1995), pp. 224-227.
-
Technical Digest of Transducers '95, Stockholm, Sweden, June 25-029, (1995)
, pp. 224-227
-
-
Lebouitz, K.S.1
Howe, R.T.2
Pisano, A.P.3
-
108
-
-
0042388263
-
Microfabrication Using One-Step LPCVD Porous Polysilicon Films
-
Dougherty, G.M., Sands, T.D., Pisano, A.P. Microfabrication Using One-Step LPCVD Porous Polysilicon Films. J. Microelectromechanical Systems, Vol. 12, (2003), pp. 418-424.
-
(2003)
J. Microelectromechanical Systems
, vol.12
, pp. 418-424
-
-
Dougherty, G.M.1
Sands, T.D.2
Pisano, A.P.3
-
109
-
-
0036709683
-
Processing and morphology of permeable polycrystalline silicon thin films
-
Dougherty, G.M., Sands, T., Pisano, A.P. Processing and morphology of permeable polycrystalline silicon thin films. J. Mater. Res., Vol. 17, (2002), pp. 2235-2242. (Pubitemid 35236741)
-
(2002)
Journal of Materials Research
, vol.17
, Issue.9
, pp. 2235-2242
-
-
Dougherty, G.M.1
Pisano, A.P.2
Sands, T.3
-
110
-
-
0030091406
-
A new process for releasing micromechanical structures in surface micromachinig
-
Benitez, M.A., Plaza, J.A., Sheng, S.Q., Esteve, J. A new process for releasing micromechanical structures in surface micromachinig. J. Micromech. Microeng, Vol. 6, (1996), pp. 36-39.
-
(1996)
J. Micromech. Microeng
, vol.6
, pp. 36-39
-
-
Benitez, M.A.1
Plaza, J.A.2
Sheng, S.Q.3
Esteve, J.4
-
111
-
-
27544461458
-
A novel micromachining process for the fabrication of monocrystalline Si-membranes using prorous silicon
-
Armbruster, S., Schäfer, F., Lammel, G., Artmann, H., Schelling, C., Benzel, H., Finkbeiner, S., Lärmer, F., Ruther, P., Paul, O. A novel micromachining process for the fabrication of monocrystalline Si-membranes using prorous silicon. Technical Digest of Transducers.03, Boston, June, (2003), pp. 246-249.
-
Technical Digest of Transducers '03, Boston, June, (2003)
, pp. 246-249
-
-
Armbruster, S.1
Schäfer, F.2
Lammel, G.3
Artmann, H.4
Schelling, C.5
Benzel, H.6
Finkbeiner, S.7
Lärmer, F.8
Ruther, P.9
Paul, O.10
-
113
-
-
84884772071
-
Micromechanical acoustic emission sensor
-
Book of Abstracts, Czech Technical University. Praha
-
Sillanpää, T., Pekko, P., Oja, A., Heikkinen, M., Kiihamäki, J., Halme, J., Seppä, H. Micromechanical acoustic emission sensor. The 16th European Conference on Solid-State Transducers, Eurosensors XVI, Sept. 15-18, Prague, Czech Republic Eurosensors XVI, Book of Abstracts, Part 1. Czech Technical University. Praha, (2002), pp. 205-206.
-
(2002)
The 16th European Conference on Solid-State Transducers, Eurosensors XVI, Sept. 15-18, Prague, Czech Republic Eurosensors XVI
, Issue.PART 1
, pp. 205-206
-
-
Sillanpää, T.1
Pekko, P.2
Oja, A.3
Heikkinen, M.4
Kiihamäki, J.5
Halme, J.6
Seppä, H.7
-
114
-
-
0031650480
-
Microelectromechanical devices for wireless communications (invited)
-
Nguyen, C.T.-C. Microelectromechanical devices for wireless communications (invited). Proceedings of 1998 IEEE International Micro Electro Mechanical Systems Workshop, Heidelberg, Germany, Jan. 25-29, (1998), pp. 1-7.
-
Proceedings of 1998 IEEE International Micro Electro Mechanical Systems Workshop, Heidelberg, Germany, Jan. 25-29, (1998)
, pp. 1-7
-
-
Nguyen, C.T.-C.1
-
115
-
-
0342651484
-
Surface micromachined 1 MHz oscillator with low-noise Pierce configuration
-
Roessig, T.A., Howe, R.T., Pisano, A.P., Smith, J.H. Surface micromachined 1 MHz oscillator with low-noise Pierce configuration. Transducers Research Foundation Workshop on Solid-State Sensors and Actuators, Hilton Head, SC, June, (1998), pp. 328-332.
-
Transducers Research Foundation Workshop on Solid-State Sensors and Actuators, Hilton Head, SC, June, (1998)
, pp. 328-332
-
-
Roessig, T.A.1
Howe, R.T.2
Pisano, A.P.3
Smith, J.H.4
-
116
-
-
0033352716
-
Noise in microelectromechanical system resonators
-
DOI 10.1109/58.808881
-
Vig, J. R., Kim, Y. Noise in Microelectromechanical System Resonators. IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control, Vol. 46, No. 6, (1999), pp. 1558-1565. (Pubitemid 30536501)
-
(1999)
IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control
, vol.46
, Issue.6
, pp. 1558-1565
-
-
Vig, J.R.1
Kim, Y.2
-
117
-
-
0036544038
-
14 MHz micromechanical oscillator
-
Mattila, T., Jaakkola, O., Kiihamäki, J., Karttunen, J., Lamminmäki, T., Rantakari, P., Oja, A., Seppä, H., Kattelus, H., Tittonen, I. 14 MHz micromechanical oscillator. Sensors and actuators A, Vol. 98-99, (2002), pp. 497-502.
-
(2002)
Sensors and Actuators A
, vol.98-99
, pp. 497-502
-
-
Mattila, T.1
Jaakkola, O.2
Kiihamäki, J.3
Karttunen, J.4
Lamminmäki, T.5
Rantakari, P.6
Oja, A.7
Seppä, H.8
Kattelus, H.9
Tittonen, I.10
-
118
-
-
0037201884
-
A 12 MHz micromechanical bulk acoustic mode oscillator
-
Mattila, T., Kiihamäki, J., Lamminmäki, T., Jaakkola, O., Rantakari, P., Oja, A., Seppä, H., Kattelus, H., Tittonen, I. A 12 MHz micromechanical bulk acoustic mode oscillator. Sensors and Actuators A, Vol. 101, (2002), pp. 1-9.
-
(2002)
Sensors and Actuators A
, vol.101
, pp. 1-9
-
-
Mattila, T.1
Kiihamäki, J.2
Lamminmäki, T.3
Jaakkola, O.4
Rantakari, P.5
Oja, A.6
Seppä, H.7
Kattelus, H.8
Tittonen, I.9
-
119
-
-
7244239515
-
Nonlinear Limits for Single-Crystal Silicon Microresonators
-
Kaajakari, V., Mattila, T., Oja, A., Seppä, H. Nonlinear Limits for Single-Crystal Silicon Microresonators. IEEE J. of Microelectromechanical Systems, Vol. 13, (2004), pp. 715-724.
-
(2004)
IEEE J. of Microelectromechanical Systems
, vol.13
, pp. 715-724
-
-
Kaajakari, V.1
Mattila, T.2
Oja, A.3
Seppä, H.4
-
120
-
-
4243144936
-
Long-term stability of single-crystal silicon microresonators
-
Koskenvuori, M., Mattila, T., Häärä, A., Kiihamäki, J., Tittonen, I., Oja A., Seppä, H. Long-term stability of single-crystal silicon microresonators. Sensors and Actuators A, Vol. 115, (2004), pp. 23-27.
-
(2004)
Sensors and Actuators A
, vol.115
, pp. 23-27
-
-
Koskenvuori, M.1
Mattila, T.2
Häärä, A.3
Kiihamäki, J.4
Tittonen, I.5
Oja, A.6
Seppä, H.7
-
121
-
-
39549114797
-
Electrical and mechanical properties of micromachined vacuum cavities
-
DOI 10.1088/0031-8949/2004/T114/049, Proceedings of the 20th Nordic Semiconductor Meeting (NSM20)
-
Kiihamäki, J., Ronkainen, H., Häärä, A., Mattila, T. Electrical and Mechanical Properties of Micromachined Vacuum Cavities. Physica Scripta, Vol. T114, (2004), pp. 195-198. (Pubitemid 351280221)
-
(2004)
Physica Scripta T
, vol.T114
, pp. 195-198
-
-
Kiihamaki, J.1
Ronkainen, H.2
Haara, A.3
Mattila, T.4
-
122
-
-
0001736550
-
Scanning Michelson interferometer for imaging surface acoustic wave fields
-
Knuuttila J.V., Tikka, P.T., Salomaa, M.M. Scanning Michelson interferometer for imaging surface acoustic wave fields. Opt. Lett., Vol. 25, (2000), pp. 613-615.
-
(2000)
Opt. Lett.
, vol.25
, pp. 613-615
-
-
Knuuttila, J.V.1
Tikka, P.T.2
Salomaa, M.M.3
-
123
-
-
84884778542
-
-
Helsinki University of Technology, Laboratory of Material Physics, unpublished results and personal communication
-
Holmgren, O., Knuuttila, J. Helsinki University of Technology, Laboratory of Material Physics, unpublished results and personal communication.
-
-
-
Holmgren, O.1
Knuuttila, J.2
-
124
-
-
39549092584
-
HV NMOS transistor for IC/MEMS integration on SOI
-
DOI 10.1088/0031-8949/2004/T114/027, Proceedings of the 20th Nordic Semiconductor Meeting (NSM20)
-
Jansson, R., Ronkainen, H., Kiihamäki, J., Mellin, J. HV NMOS Transistor for IC/MEMS Integration on SOI. Physica Scripta, Vol. T114, (2004), pp. 110-112. (Pubitemid 351280200)
-
(2004)
Physica Scripta T
, vol.T114
, pp. 110-112
-
-
Jansson, R.1
Ronkainen, H.2
Kiihamaki, J.3
Mellin, J.4
-
125
-
-
4644292972
-
Monolithic SOI-MEMS capacitive pressure sensor with standard bulk CMOS readout circuit
-
Ylimaula, M., Åberg, M., Kiihamäki, J., Ronkainen, H. Monolithic SOI-MEMS capacitive pressure sensor with standard bulk CMOS readout circuit. 29th European Solid-State Circuits Conference, ESSCIRC 2003, 16-18 Sept 2003, Estoril, Portugal. IEEE. New York, (2003), pp. 611-614.
-
29th European Solid-State Circuits Conference, ESSCIRC 2003, 16-18 Sept 2003, Estoril, Portugal. IEEE. New York, (2003)
, pp. 611-614
-
-
Ylimaula, M.1
Åberg, M.2
Kiihamäki, J.3
Ronkainen, H.4
|