메뉴 건너뛰기




Volumn 5342, Issue , 2004, Pages 111-118

Characterization of the Microloading Effect in Deep Reactive Ion Etching of Silicon

Author keywords

Depletion radius; DRIE; Microloading

Indexed keywords

CHEMICAL MECHANICAL POLISHING; FINITE ELEMENT METHOD; MASKS; PLASMAS; REACTIVE ION ETCHING; SEMICONDUCTING SILICON;

EID: 2142769904     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.524461     Document Type: Conference Paper
Times cited : (28)

References (16)
  • 2
    • 0036030223 scopus 로고    scopus 로고
    • Compensation of resist trim process and poly gate plasma microloading effect for lithography process window and CD uniformity improvement
    • K. M. Lee, C. W. Fan, J. R. Hwang, C. C. Liu, and K. C. Hung, "Compensation of resist trim process and poly gate plasma microloading effect for lithography process window and CD uniformity improvement," Proceedings of SPIE - The International Society for Optical Engineering 4689 II, pp. 1007-1016, 2002.
    • (2002) Proceedings of SPIE - The International Society for Optical Engineering , vol.4689 II , pp. 1007-1016
    • Lee, K.M.1    Fan, C.W.2    Hwang, J.R.3    Liu, C.C.4    Hung, K.C.5
  • 3
    • 0036565356 scopus 로고    scopus 로고
    • Characterization and modeling of oxide chemical-mechanical polishing using planarization length and pattern density concepts
    • D. Ouma, D. Boning, J. Chung, W. Easter, V. Saxena, S. Misra, and A. Crevasse, "Characterization and modeling of oxide chemical-mechanical polishing using planarization length and pattern density concepts," IEEE Transactions on Semiconductor Manufacturing 15(2), pp. 232-244, 2002.
    • (2002) IEEE Transactions on Semiconductor Manufacturing , vol.15 , Issue.2 , pp. 232-244
    • Ouma, D.1    Boning, D.2    Chung, J.3    Easter, W.4    Saxena, V.5    Misra, S.6    Crevasse, A.7
  • 7
    • 0037241722 scopus 로고    scopus 로고
    • Advanced fiber optical switches using deep RIE (DRIE) fabrication
    • J. Li, Q. Zhang, and A. Liu, "Advanced fiber optical switches using deep RIE (DRIE) fabrication," Sensors and Actuators A: Physical 102(3), pp. 286-295, 2003.
    • (2003) Sensors and Actuators A: Physical , vol.102 , Issue.3 , pp. 286-295
    • Li, J.1    Zhang, Q.2    Liu, A.3
  • 12
    • 0035452472 scopus 로고    scopus 로고
    • 2-based chemistry with cryogenical wafer cooling and a high density ICP source
    • 2-based chemistry with cryogenical wafer cooling and a high density ICP source," Microelectronics Journal 32(9), pp. 769-777, 2001.
    • (2001) Microelectronics Journal , vol.32 , Issue.9 , pp. 769-777
    • Jansen, H.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.