Critical review: Adhesion in surface micromechanical structures

Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures

Volumn 15, Issue 1, 1997, Pages 1-20

  Maboudian, Roya ^a   Howe, Roger T ^b  

^a University of California   (United States)

^b UNIVERSITY OF CALIFORNIA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 3943070464     PISSN: 10711023     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.589247     Document Type: Review

References (80)

1. H. C. Nathanson, W. E. Newell, R. A. Wickstrom, and J. R. Davis, Jr., IEEE Trans. Electron Devices ED-14, 117 (1967).
2. R. T. Howe, J. Vac. Sci. Technol. B 6, 1809 (1988).
3. R. T. Howe, B. E. Boser, and A. P. Pisano, Sens. Actuators A 56, 167 (1996).
4. L. J. Hornbeck, Proceedings of the IEEE International Electron Devices Meeting, Washington, D.C., 1993, pp. 381-384; Proc. SPIE 2639, 2 (1995).
5. L. J. Hornbeck, Proceedings of the IEEE International Electron Devices Meeting, Washington, D.C., 1993, pp. 381-384; Proc. SPIE 2639, 2 (1995).
6. J. B. Sampsell, J. Vac. Sci. Technol. B 12, 3242 (1994).
7. R. S. Payne, S. Sherman, S. Lewis, and R. T. Howe, Proceedings of the IEEE International Solid-State Circuits Conference, San Francisco, CA, 1995, pp. 164-165.
8. K. H.-L. Chau et al., Proceedings of the 8th International Conference on Solid-State Sensors and Actuators, Transducers '95, Stockholm, Sweden, 1995, pp. 593-596.
9. J. H. Smith, S. Montague, and J. J. Sniegowski, Proc. SPIE 2639, 64 (1995).
10. G. K. Fedder and R. T. Howe, IEEE J. Micro-Electro-Mechan. Syst. (in press).
11. R. L. Alley, R. T. Howe, and K. Komvopoulos, Proceedings of the IEEE Solid-State Sensor and Actuator Workshop, Hilton Head, SC, 1992, pp. 202-207.
12. B. Bhushan, Tribology and Mechanics of Magnetic Storage Devices (Springer, New York, 1990).
13. M. W. Judy and R. T. Howe, Proceedings of the 7th International Conference on Solid-State Sensors and Actuators, Transducers '93, Yokohama, Japan, 1993, pp. 54-57.
14. K. A. Shaw and N. C. MacDonald, Proceedings of the 9th IEEE International Workshop on Micro-Electro-Mechanical Systems (MEMS-96), San Diego, CA, 11-15 February 1996, pp. 44-48.
15. H. Jansen, M. de Boer, and M. Elwenspoek, in Ref. 13, pp. 250-257.
16. G. K. Fedder et al., in Ref. 13, pp. 13-18.
17. Y.-C. Tai and R. S. Muller, Sens. Actuators 20, 48 (1989).
18. M. Mehregany, P. Nagarkar, S. D. Senturia, and J. H. Lang, Proc. IEEE Micro-Electro-Mechanical Systems Workshop, Napa Valley, CA, 1990, pp. 1-8.
19. J. J. Sniegowski and E. J. Garcia, Proc. SPIE 2383, 46 (1995).
20. J. J. Sniegowski and E. J. Garcia, in Ref. 13, pp. 366-371.
21. J. J. Sniegowski et al., Proc. IEEE Solid-State Sensor and Actuator Workshop, Hilton Head, SC, 1996, pp. 178-182.
22. J. J. Sniegowski and E. J. Garcia, IEEE Electron Device Lett. 17, 366 (1996).
23. L. Y. Lin, S. S. Lee, M. C. Wu, and K. S. J. Pister, Proc. IEEE Micro-Electro-Mechanical Systems Workshop, Amsterdam, The Netherlands, 1995, pp. 77-82.
24. M. J. Daneman et al., in Ref. 22, pp. 56-60.
25. M. Grundner and H. Jacob, Appl. Phys. A 39, 73 (1986).
26. A. W. Adamson, Physical Chemistry of Surfaces, 5th ed. (Wiley, New York, 1990).
27. J. N. Israelachvili, Intermolecular and Surface Forces (Academic, London, 1985).
28. T. Abe, W. C. Messner, and M. L. Reed, J. Micro-Electro.-Mechan. Syst. 4, 66 (1995).
29. H. Guckel, J. J. Sniegowski, T. R. Christenson, and F. Raissi, Sens. Actuators A 21-23, 346 (1990).
30. G. T. Mulhern, D. S. Soane, and R. T. Howe, in Ref. 12, pp. 296-300.
31. M. Biebl, G. T. Mulhern, and R. T. Howe, in Ref. 7, pp. 198-202.
32. Equation (5) differs from the expression given by Alley et al. in Ref. 10. The discrepancy stems from the fact that a constant condensate volume is assumed in Eq. (5), whereas a constant wetted area is assumed in Ref. 10. As far as in-use adhesion is concerned, we believe that the former assumption is more appropriate.
33. W. Shockley et al., Surf. Sci. 2, 277 (1964).
34. M. J. Madou and S. R. Morrison, Chemical Sensing with Solid State Devices (Academic, Boston, 1989).
35. N. A. Burnham, R. J. Colton, and H. M. Pollock, Phys. Rev. Lett. 69, 144 (1992).
36. E. Cheng and M. W. Cole, Phys. Rev. B 38, 987 (1988).
37. G. Vidali, G. Ihm, H.-Y. Kim, and M. W. Cole, Surf. Sci. Rep. 12, 133 (1991).
38. R. Lechtenberg, H. A. C. Tilmans, J. Elders, and M. Elwenspoek, Sens. Actuators A 43, 230 (1994).
39. D. Maugis, J. Adhesion Sci. Technol. 10, 161 (1996), and references therein.
40. K. N. G. Fuller and D. Tabor, Proc. R. Soc. London, Ser. A 345, 327 (1975).
41. D. M. Schaefer, M. Carpenter, B. Gady, R. Reifenberger, L. P. Demejo, and D. S. Rimai, J. Adhesion Sci. Technol. 9, 1049 (1995).
42. R. C. Thomas, J. E. Houston, R. M. Crooks, T. Kim, and T. A. Michalske, J. Am. Chem. Soc. 117, 3830 (1995).
43. C. H. Mastrangelo and C. H. Hsu, in Ref. 10, pp. 203-208.
44. D. Graf, M. Grundner, R. Schulz, and L. Mühlhoff, J. Appl. Phys. 68, 5155 (1990).
45. M. R. Houston, R. Maboudian, and R. T. Howe, in Ref. 7, pp. 210-214.
46. M. R. Houston, R. T. Howe, and R. Maboudian, J. Appl. Phys. (in press).
47. C. Carraro and R. Maboudian (unpublished).
48. R. L. Alley, P. Mai, K. Komvopoulos, and R. T. Howe, in Ref. 12, pp. 288-292.
49. Y. Yee, K. Chun, and J. D. Lee, in Ref. 7, pp. 206-210.
50. L.-S. Fan, Y.-C. Tai, and R. S. Muller, Proceedings of the IEEE International Electron Devices Meeting, San Francisco, CA, 1988, pp. 666-670.
51. G. S. Higashi and Y. J. Chabal, Handbook of Semiconductor Wafer Cleaning Technology, edited by W. Kern (Noyes, New York, 1993), p. 433.
52. M. R. Houston and R. Maboudian, J. Appl. Phys. 78, 3801 (1995).
53. P. Dumas and Y. J. Chabal, Chem. Phys. Lett. 181, 537 (1991).
54. G. S. Higashi, Y. J. Chabal, G. W. Trucks, and K. Raghavachari, Appl. Phys. Lett. 56, 656 (1990).
55. P. Dumas, Y. J. Chabal, and P. Chabal, Appl. Surf. Sci. 65/66, 580 (1993).
56. W. Kern and D. A. Puotinen, RCA Rev. 30, 187 (1970).
57. G. J. Kluth and R. Maboudian, J. Appl. Phys. 80, 5408 (1996).
58. A. Ulman, Introduction to Ultra-thin Organic Films: From Langmuir Blodgett to Self-Assembly (Academic, San Diego, 1991).
59. J. B. Brzoska, I. B. Azouz, and F. Rondelez, Langmuir 10, 4367 (1994).
60. A. N. Parikh, D. L. Allara, I. B. Azouz, and F. Rondelez, J. Phys. Chem. 98, 7577 (1994).
61. S. R. Wasserman, Y.-T. Tao, and G. Whitesides, Langmuir 5, 1074 (1989).
62. L. Hornbeck, U.S. Patent Nos. 5,331,454 and 5,411,769, both continuances of Series No. 612,946 filed 13 November 1990.
63. K. Deng, R. J. Collins, M. Mehregany, and C. N. Sukkenik, in Ref. 22, pp. 368-375.
64. M. R. Houston, R. Maboudian, and R. T. Howe, in Ref. 20, pp. 42-47.
65. J. Kluth and R. Maboudian (unpublished).
66. P. F. Man, B. P. Gogoi, and C. H. Mastrangelo, in Ref. 13, pp. 55-59.
67. F. Kozlowski, N. Lindmair, Th. Scheiter, C. Hierold, and W. Lang, in Ref. 6, pp. 220-223.
68. M. R. Houston, R. T. Howe, K. Komvopoulos, and R. Maboudian, Mater. Res. Soc. Symp. Proc. 383, 391 (1995).
69. G. M. Pharr et al., Appl. Phys. Lett. 68, 779 (1996), and references therein.
70. G. D. Merfeld and M. A. Petrich, J. Vac. Sci. Technol. A 12, 365 (1994).
71. D. J. Monk, D. S. Soane, and R. T. Howe, J. Electrochem. Soc. 141, 264 (1994); 141, 271 (1994).
72. D. J. Monk, D. S. Soane, and R. T. Howe, J. Electrochem. Soc. 141, 264 (1994); 141, 271 (1994).
73. W. C. Tang, Ph.D. thesis, Dept. of EECS, University of California at Berkeley, December 1990.
74. M. W. Judy, Ph.D. thesis, Dept. of EECS, University of California at Berkeley, April 1994.
75. N. Takeshima et al., Proc. 6th International Conference on Solid-State Sensors and Actuators, Transducers '91, San Francisco, CA, 1991, pp. 63-66.
76. C. H. Mastrangelo and G. S. Saloka, Proc. IEEE Micro-Electro-Mechan. Systems Workshop, Ft. Lauderdale, FL, 1993, pp. 77-81.
77. T. A. Core and R. T. Howe, U.S. Patent No. 5,314,572 24 May 1994.
78. K. S. Lebouitz, R. T. Howe, and A. P. Pisano, in Ref. 7, pp. 224-227.
79. M. B. Cohn, Y. Liang, R. T. Howe, and A. P. Pisano, in Ref. 20, pp. 32-35.
80. B. Bhushan, in Ref. 13, pp. 91-98.