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Volumn , Issue , 1993, Pages 627-630

A 0.6 µm2 256Mb Trench DRAM Cell with Self-Aligned Buried Strap (BEST)

Author keywords

[No Author keywords available]

Indexed keywords

DYNAMIC RANDOM ACCESS STORAGE; INTEGRATED CIRCUIT DESIGN; CELLULAR ARRAYS; ELECTRIC CONNECTORS; ETCHING; SEMICONDUCTOR DEVICE MANUFACTURE; SUBSTRATES;

EID: 0027814761     PISSN: 01631918     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper
Times cited : (39)

References (7)
  • 5
    • 0025575974 scopus 로고
    • Process integration for 64M DRAM using an Asymmetrical Stacked Trench capacitor (AST) Cell
    • K. Sunouchi et al, "Process integration for 64M DRAM using an Asymmetrical Stacked Trench capacitor (AST) Cell," 1990 Symposium on VLSI Technology Digest of Technical Papers, pp. 647-650, 1990.
    • (1990) 1990 Symposium on VLSI Technology Digest of Technical Papers , pp. 647-650
    • Sunouchi, K.1
  • 6
    • 0024177063 scopus 로고
    • A variable-size Shallow Trench Isolation (STI) technology with diffused sidewall doping for submicron CMOS
    • B. Davari et al., "A variable-size Shallow Trench Isolation (STI) technology with diffused sidewall doping for submicron CMOS," 1988 IEDM Technical Digest, pp. 92-95, 1988.
    • (1988) 1988 IEDM Technical Digest , pp. 92-95
    • Davari, B.1
  • 7
    • 84954181788 scopus 로고
    • Trench storage capacitors for high density DRAMs
    • T.V. Rajeevakumar, et al., "Trench storage capacitors for high density DRAMs," 1991 IEDM Technical Digest, pp. 835-838, 1991.
    • (1991) 1991 IEDM Technical Digest , pp. 835-838
    • Rajeevakumar, T.V.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.