메뉴 건너뛰기




Volumn 13, Issue 5, 2003, Pages 790-794

A dry single-step process for the manufacture of released MEMS structures

Author keywords

[No Author keywords available]

Indexed keywords

HYDROFLUORIC ACID; INDUCTIVELY COUPLED PLASMA; MICROELECTROMECHANICAL DEVICES; REACTIVE ION ETCHING; SCANNING ELECTRON MICROSCOPY; SEMICONDUCTOR DEVICE MANUFACTURE; SILICON ON INSULATOR TECHNOLOGY; SILICON WAFERS;

EID: 0141495411     PISSN: 09601317     EISSN: None     Source Type: Journal    
DOI: 10.1088/0960-1317/13/5/335     Document Type: Article
Times cited : (29)

References (10)
  • 1
    • 0141840550 scopus 로고
    • Bosch GmbH R B; US Patent 4855017, Germany Patent 4241045CI
    • Bosch GmbH R B 1994 US Patent 4855017, Germany Patent 4241045CI
    • (1994)
  • 4
    • 0035450041 scopus 로고    scopus 로고
    • The application of secondary effects in high aspect ration dry etching for the fabrication of MEMS
    • Volland B E, Heerlein H, Kostic I and Rangelow I W 2001 The application of secondary effects in high aspect ration dry etching for the fabrication of MEMS Microelectron. Eng. 57-58 641-50
    • (2001) Microelectron. Eng. , vol.57-58 , pp. 641-650
    • Volland, B.E.1    Heerlein, H.2    Kostic, I.3    Rangelow, I.W.4
  • 5
    • 0035880212 scopus 로고    scopus 로고
    • Anisotropic silicon trenches 300-500 μm deep employing time multiplexing deep etching (TMDE)
    • Ayon A A, Zhang X and Khanna R 2001 Anisotropic silicon trenches 300-500 μm deep employing time multiplexing deep etching (TMDE) Sensors Actuators A 91 381-5
    • (2001) Sensors Actuators A , vol.91 , pp. 381-385
    • Ayon, A.A.1    Zhang, X.2    Khanna, R.3
  • 7
    • 0141729202 scopus 로고    scopus 로고
    • (Prince of Wales Industrial Park: Surface Technology Systems Ltd) Abercam, gwent, NP1 5AR
    • Bhardwaj J, Ashraf H and McQuarri A Dry Silicon Etching for MEMS (Prince of Wales Industrial Park: Surface Technology Systems Ltd) Abercam, gwent, NP1 5AR
    • Dry Silicon Etching for MEMS
    • Bhardwaj, J.1    Ashraf, H.2    McQuarri, A.3
  • 8
    • 14244251693 scopus 로고    scopus 로고
    • Characterisation and optimization of deep dry etching for MEMS applications
    • (Malvern, UK: Defence Evaluation and Research Agency)
    • Rickard A and McNie M Characterisation and optimization of deep dry etching for MEMS applications Microsystems and Microengineering (Malvern, UK: Defence Evaluation and Research Agency)
    • Microsystems and Microengineering
    • Rickard, A.1    McNie, M.2
  • 10
    • 33645340155 scopus 로고    scopus 로고
    • Pattern shap effects and artifacts in deep silicon etching
    • Kiihamaki J and Franssila S 1999 Pattern shap effects and artifacts in deep silicon etching J. Vac. Sci. Technol A 17 2280-5
    • (1999) J. Vac. Sci. Technol A , vol.17 , pp. 2280-2285
    • Kiihamaki, J.1    Franssila, S.2


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.