Etching processes for high aspect ratio micro systems technology (HARMST)

Microsystem Technologies

Volumn 3, Issue 1, 1996, Pages 20-27

  Kassing, R ^a   Rangelow, I W ^a  

^a UNIVERSITY OF KASSEL   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0008600390     PISSN: 09467076     EISSN: None     Source Type: Journal    
DOI: 10.1007/s005420050049     Document Type: Article

References (28)

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3. Gianchandani Y; Najafi K: (1992) Batch fabrication and assemly of micromotor-driven mechanisms with multi-level linkages. In: Ibid, pp. 141-146
4. Ginachandani Y; Najafi K: (1992) Micron-sized, high aspect ratio bulk silicon micromechanical devices. In: Ibid pp. 208-213
5. Zhang ZL; Porklab GyA; MacDonald NC: (1992) Submicron, movable galium arsenide mechanical structures and actuators. In: Ibid, pp. 72-77
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11. Ulacia JL; McVitte JP: (1989) A two-dimensional computer simulation for dry etching using Monte Carlo techniques. J Appl Phys 65: 1484-1491
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15. 4/Si. Proceedings of the 11th International Symposium on Plasma Chemistry, Loughborough, UK, 22-27 August, 1993, pp. 909-914
16. Rangelow IW; Kassing R: (1988) Inhibitor films as microetching tools in pattern transfer technology. Plasma Surface Engineering 1: 473-478
17. Rangelow IW; Thoren P; Maßeli K; Kassing R; Engelhardt M; Schwarzl S: (1986) Secondary effects of single crystalline silicon deep-trench-etching in a chlorine-containing plasma for 3-dimensional capacitor cells. Microelectr Eng 5: 387-394
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19. Rangelow IW; Thoren P; Kassing R: (1985) Computer simulation of pattern profiles through physical etching with shadow, trenching, and redeposition. Microelectr Eng 3: 631-638
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21. Fichelscher A; Rangelow IW; Kassing R: (1990) Simulation of RIE-processes considering sheath dynamics. Proc. of Second International Conf. on Plasma Surface Engineering in Garmisch-Partenkirchen, FRG, Sept. 10-14, 1990, published in: Materials Science and Engineering, A 139: 412-417
22. Rangelow IW; Löschner H: (1995) Reactive ion etching for MEMS fabrication. J Vac Sci Technol 2394-2399
23. Rangelow IW; Hudek P; Shi F: (1995) Bulk micromachining of Si by lithography and reactive ion etching (LIRIE). Vacuum 46: 1361-1369
24. Rangelow IW; Hudek P; Shi F; Kostio I; Kassing R; Löschner; Caahipka A; Hammel E; Stengl G; Vonach H: (1995) Stencil maasken für die ionen projektions lithographie und für die maskierte ionenstrahl lithographie. VDI-Bericht von VDI Fachtagung "Maskentechnik für Mikroelektronik-/Mikrotechnik-Bausteine" 25/26 Oct. 1995, München, pp. 13-118
25. Hudek P; Rangelow IW; Kostic I; Münzel N; Daraktchiev I: (1996) Evaluation of chemically amplified deep UV resist for micromachining using E-beam lithography and dry etching. Microelectronic Eng 30: 309-312
26. Rangelow IW; Shi F; Hudek P; Kostic I; Hammel E; Löschner H; Stengl G; Traher C: (1996) Silicon stencil masks for masked ion beam lithography proximity printing. Microelectronic Eng 30: 257-260
27. 3 Plasma. Microelectr Eng 23: 361-364
28. Tachi S; Tsujimoto K; Arai S; Kure T: (1991) Low temperature dry etching. J Vac Sci Technol A9(3): 796-803