Comparison of Bosch and cryogenic processes for patterning high aspect ratio features in silicon

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 4407, Issue , 2001, Pages 89-99

  Walker, M J ^a  

^a OXFORD INSTRUMENTS PLASMA TECHNOLOGY   (United Kingdom)

Author keywords

Cryogenic silicon etching; High aspect ratio silicon etch; High density plasma etching; Silicon micromachining; Surface micromachining

Indexed keywords

ASPECT RATIO; CRYOGENICS; DRY ETCHING; MICROMACHINING; PLASMA ETCHING; SEMICONDUCTING SILICON; SURFACE PHENOMENA;

BOSCH PROCESSES; CRYOGENICALLY COOLED PROCESSES;

MICROELECTROMECHANICAL DEVICES;

EID: 0034850698     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.425288     Document Type: Conference Paper

References (5)

1. Pattern shape effects and artefacts in deep silicon etching
2. Improvement of sidewall roughness in deep silicon etching
3. The black silicon method: A universal method for determining the parameter setting of a fluorine based reactive ion etcher in deep silicon trench etching with profile control
4. DEEMO: A new technology for the fabrication of microstructures