Surface micromachining for microelectromechanical systems

Proceedings of the IEEE

Volumn 86, Issue 8, 1998, Pages 1552-1573

  Bustjllo, James M ^a   Howe, Roger T ^a   Muller, Richard S ^b  

^a UNIVERSITY OF CALIFORNIA   (United States)

^b Departments of Electrical Engineering and Computer Science and Mechanical Engineering

Author keywords

Integrated mems; MEMS; Microelectromechanical systems; Micropackaging; Poly silicon micromachining; Sacrificial release layer; Stiction; Surface micromachining

Indexed keywords

ELECTRONICS PACKAGING; ETCHING; MECHANICAL PROPERTIES; MICROELECTROMECHANICAL DEVICES; MICROELECTRONIC PROCESSING; SEMICONDUCTING SILICON; SENSORS; STICTION; TECHNOLOGY; THIN FILMS;

MICROELECTROMECHANICAL SYSTEMS; MICROPACKAGING; SACRIFICIAL RELEASE LAYER;

MICROMACHINING;

EID: 0032138470     PISSN: 00189219     EISSN: None     Source Type: Journal    
DOI: 10.1109/5.704260     Document Type: Article

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