Vacuum encapsulation of resonant devices using permeable polysilicon

Proceedings of the IEEE Micro Electro Mechanical Systems (MEMS)

Volumn , Issue , 1999, Pages 470-475

  Lebouitz, Kyle S ^a   Mazaheri, Aida ^a   Howe, Roger T ^a   Pisano, Albert P ^a  

^a UNIVERSITY OF CALIFORNIA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DEPOSITION; ENCAPSULATION; ETCHING; POLYCRYSTALLINE MATERIALS; RESONATORS; SEMICONDUCTING SILICON; VACUUM TECHNOLOGY;

MICRORESONATORS; VACUUM MICROPACKAGING TECHNOLOGY;

MICROELECTROMECHANICAL DEVICES;

EID: 0032678755     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/memsys.1999.746874     Document Type: Conference Paper

References (23)