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Journal of Materials Science: Materials in Electronics
Volumn 22, Issue 6, 2011, Pages 565-578
Recent advances on Sn-Cu solders with alloying elements: Review
Author keywords

[No Author keywords available]
Indexed keywords

COMPREHENSIVE PROPERTIES; ELECTRONICS SYSTEM; FURTHER DEVELOPMENT; MELTING AND SOLIDIFICATION; SECONDARY PARTICLES; SN-CU SOLDERS; SOLDER ALLOYS; SOLDER JOINTS;
EID: 79958858044     PISSN: 09574522     EISSN: 1573482X     Source Type: Journal    
DOI: 10.1007/s10854-011-0291-3     Document Type: Article
Times cited : (70)
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