Reliability of anisotropic conductive adhesive joints in electronic packaging applications

Journal of Adhesion Science and Technology

Volumn 22, Issue 14, 2008, Pages 1631-1657

  Lin, Y C ^a,b   Chen, X ^a  

^a TIANJIN UNIVERSITY   (China)

^b CENTRAL SOUTH UNIVERSITY   (China)

Author keywords

Anisotropic conductive adhesives (ACA); Bonding process; Hygrothermal aging; Reliability

Indexed keywords

ANISOTROPIC CONDUCTIVE ADHESIVE JOINTS; ANISOTROPIC CONDUCTIVE ADHESIVES; ANISOTROPIC CONDUCTIVE ADHESIVES (ACA); BONDING PRESSURE; BONDING PROCESS; BONDING TEMPERATURES; CONDUCTIVE PARTICLE; CURING CONDITION; ELECTRONIC PACKAGING; ELECTRONIC SYSTEMS; ENVIRONMENTAL DEMANDS; ENVIRONMENTAL FACTORS; HIGH TEMPERATURE; HYGROTHERMAL AGING; IMPACT LOADS; PACKAGING TECHNOLOGIES; REFLOW PROCESS; RELIABILITY PROBLEMS; RESEARCH AND DEVELOPMENT; RESEARCH AREAS; SOLDER INTERCONNECTS;

ADHESIVES; ANISOTROPY; ELECTRONICS PACKAGING; PACKAGING MATERIALS; RELIABILITY;

ADHESIVE JOINTS;

EID: 68949105908     PISSN: 01694243     EISSN: 15685616     Source Type: Journal    
DOI: 10.1163/156856108X325055     Document Type: Article

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