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EPJ Applied Physics

Volumn 48, Issue 2, 2009, Pages

Effect of cooling rate on structure and creep behavior of Sn-0.7Cu-0.5Zn lead-free solder alloy

(1) Gouda, E S a

a NATIONAL RESEARCH CENTRE (Egypt)

Author keywords

[No Author keywords available]

Indexed keywords

COOLING CONDITIONS; COOLING RATES; CREEP BEHAVIORS; CU ATOMS; INDENTATION CREEP; INTERMETALLIC COMPOUNDS; LEAD-FREE SOLDER ALLOY; MATRIX; MATRIX PHASE; SLOW COOLED; SLOW COOLING; VICKERS MICROHARDNESS TESTER; XRD;

ALLOYS; CERIUM ALLOYS; COOLING; COPPER ALLOYS; CREEP; CRYSTALLITE SIZE; FREEZING; GRAIN REFINEMENT; LEAD; MECHANICAL PROPERTIES; MELTING; MELTING POINT; MICROHARDNESS; SEMICONDUCTING INTERMETALLICS; SOLDERING ALLOYS; TIN ALLOYS; X RAY DIFFRACTION; X RAY DIFFRACTION ANALYSIS; ZINC;

TIN;

EID: 70449564652 PISSN: 12860042 EISSN: 12860050 Source Type: Journal
DOI: 10.1051/epjap/2009139 Document Type: Article

Times cited : (7)

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