The maximum fluidity length of solidifying Sn-Cu-Ag-Ni solder alloys

Journal of Electronic Materials

Volumn 37, Issue 1, 2008, Pages 51-60

  Gourlay, C M ^a   Read, J ^a   Nogita, K ^a   Dahle, A K ^a  

^a UNIVERSITY OF QUEENSLAND   (Australia)

Author keywords

Fluidity; Lead free soldering; Phase equilibria; Solidification

Indexed keywords

LEAD-FREE SOLDER ALLOYS; MICROSTRUCTURE ARRESTS FLOW;

COOLING; FLUIDITY; PHASE EQUILIBRIA; SILVER ALLOYS; SOLIDIFICATION;

SOLDERING ALLOYS;

EID: 37249093525     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-007-0248-8     Document Type: Article

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