Interfacial reactions between Sn-Cu based multicomponent solders and Ni substrates during soldering and aging

Soldering and Surface Mount Technology

Volumn 21, Issue 2, 2009, Pages 19-23

  Zhao, Ning ^a   Ma, Hai Tao ^a   Wang, Lai ^a  

^a DALIAN UNIVERSITY OF TECHNOLOGY   (China)

Author keywords

Chemical reactions; Soldering; Solders

Indexed keywords

AGING TIME; CU-BASED; DESIGN/METHODOLOGY/APPROACH; IMC LAYER; INTERFACIAL REACTIONS; INTERMETALLIC COMPOUNDS; ISOTHERMAL AGING; MATRIX; MELTING BEHAVIOR; MULTICOMPONENTS; NI SUBSTRATES; ONSET TEMPERATURE; PB FREE SOLDERS; RELIABILITY PROBLEMS; SOLDERS;

DIFFERENTIAL SCANNING CALORIMETRY; GOLD; GOLD ALLOYS; GRAFTING (CHEMICAL); LEAD; NICKEL; SEMICONDUCTING INTERMETALLICS; SOLDERING; SOLDERING ALLOYS; SYNTHESIS (CHEMICAL); TIN ALLOYS;

TIN;

EID: 70349227475     PISSN: 09540911     EISSN: None     Source Type: Journal    
DOI: 10.1108/09540910910947435     Document Type: Article

References (12)

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