Study on the microstructure and the shear strength of Sn-0.7Cu-xZn

2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2009

Volumn , Issue , 2009, Pages 890-893

  Gao, Yan Jun ^a   Luo, Zhong Bing ^a   Zhao, Jie ^a   Wang, Lai ^a  

^a DALIAN UNIVERSITY OF TECHNOLOGY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

INTERMETALLIC COMPOUNDS; LOG-LOG PLOTS; REFINED MICROSTRUCTURE;

DUCTILE FRACTURE; ELECTRONICS PACKAGING; EUTECTICS; MICROSTRUCTURE; PACKAGING; SEMICONDUCTING INTERMETALLICS; SHEAR STRENGTH; SOLDERING ALLOYS; STEELMAKING; STRAIN RATE; TIN; ZINC;

MELTING POINT;

EID: 70449813260     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICEPT.2009.5270550     Document Type: Conference Paper

References (9)

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