Reliability investigation and interfacial reaction of ball-grid-array packages using the lead-free Sn-Cu solder

Journal of Electronic Materials

Volumn 33, Issue 10, 2004, Pages 1190-1199

  Yoon, Jeong Won ^a   Kim, Sang Won ^a   Koo, J A Myeong ^a   Kim, Dae Gon ^a   Jung, Seung Boo ^a  

^a Sungkyunkwan University   (South Korea)

Author keywords

Ball shear test; Electrical resistivity; Interfacial reaction; Intermetallic compound (IMC); Isothermal aging; Sn Cu solder

Indexed keywords

CONCENTRATION (PROCESS); ELECTRIC RESISTANCE; ELECTRONICS PACKAGING; RELIABILITY; SHEAR STRENGTH; SOLDERING ALLOYS; SUBSTRATES;

BALL SHEAR TEST; BALL-GRID-ARRAY (BGA); ISOTHERMAL AGING; SN-CU SOLDER;

SURFACE REACTIONS;

EID: 7044228182     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-004-0122-x     Document Type: Conference Paper

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