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Volumn 22, Issue 3, 2011, Pages 281-285
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A novel method of reducing melting temperatures in SnAg and SnCu solder alloys
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Author keywords
[No Author keywords available]
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Indexed keywords
ALLOY SYSTEM;
CU ALLOY;
EUTECTIC ALLOYS;
EXPERIMENTAL DATA;
LEAD-FREE SOLDER ALLOY;
LOW MELTING;
LOW TEMPERATURES;
MECHANICAL ATTRITION;
MELTING TEMPERATURES;
NANO SCALE;
NANOSIZE EFFECTS;
NOVEL METHODS;
ROBUST METHODS;
SIZE-DEPENDENT MELTING;
SN-3.5AG;
SN-CU SOLDERS;
SOLDER PASTE;
SOLDERING PROCESS;
STIR CASTING;
WAVE SOLDERING;
CERIUM ALLOYS;
COPPER ALLOYS;
DIFFERENTIAL SCANNING CALORIMETRY;
MELTING POINT;
METAL MELTING;
NANOPARTICLES;
SILVER;
SOLDERING;
SOLDERING ALLOYS;
TIN;
TIN ALLOYS;
ALLOYS;
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EID: 79751526808
PISSN: 09574522
EISSN: 1573482X
Source Type: Journal
DOI: 10.1007/s10854-010-0128-5 Document Type: Article |
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Times cited : (12)
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References (10)
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