Comparative wetting behavior of Sn-0.7Cu and Sn-0.7Cu-0.3Ni solders on Cu and Ni substrates

ESTC 2006 - 1st Electronics Systemintegration Technology Conference

Volumn 1, Issue , 2006, Pages 145-151

  Rizvi, M J ^a   Bailey, C ^a   Chan, Y C ^b   Lu, H ^a  

^a UNIVERSITY OF GREENWICH   (United Kingdom)

^b CITY UNIVERSITY OF HONG KONG   (Hong Kong)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS PACKAGING; ORGANIC ACIDS; SUBSTRATES; TIN METALLURGY; WETTING;

ELECTRONIC PACKAGING INDUSTRIES; METALLURGICAL PROPERTIES; WETTING BEHAVIOR;

SOLDERING ALLOYS;

EID: 42549084218     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ESTC.2006.279992     Document Type: Conference Paper

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