Hillock and whisker growth on Sn and SnCu electrodeposits on a substrate not forming interfacial intermetallic compounds

Journal of Electronic Materials

Volumn 36, Issue 3, 2007, Pages 214-219

  Williams, M E ^a   Moon, K W ^a   Boettinger, W J ^a   Josell, D ^a   Deal, A D ^b  

^a NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY   (United States)

^b Lehigh University   (United States)

Author keywords

Focused ion beam (FIB); Interfacial intermetallic compound (IMC); Tin whiskers

Indexed keywords

ELECTRODEPOSITS; INTERFACIAL INTERMETALLIC COMPOUND (IMC); WHISKER GROWTH;

COMPRESSIVE STRESS; CRYSTAL WHISKERS; ELECTROPLATING; FOCUSED ION BEAMS; GROWTH (MATERIALS); INTERFACES (MATERIALS); TINNING;

INTERMETALLICS;

EID: 34247634206     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-006-0071-7     Document Type: Article

References (16)

1. S.M. Arnold, Plating 53, 96 (1966).
2. The Restriction of the Use of Certain Hazardous Substances (RoHS) in Electrical and Electronic Equipment Regulations, July 1, 2006, website http://www.rohs.gov.uk/Docs/uksi_20061463_en1.pdf (2006).
3. NASA Goddard Space Flight Center Tin Whisker (and Other Metal Whisker) Homepage, website http://nepp.nasa.gov/whisker/ (2006).
4. R.M. Fisher, L.S. Darken, and K.G. Carroll, Acta Metall. 2, 368 (1954).
5. B.D. Dünn, Circuit World 2, 32 (1976).
6. C. Xu, IEEE Trans. Electron. Packag. 28, 31 (2005).
7. A.T. Vagramyan and Z.A. Soloveva Technology of Electrodeposition (Teddington, England: English translation, 1961).
8. B.Z. Lee and D.N. Lee, Acta Mater. 46, 3701 (1998).
9. K.N. Tu, Phys. Rev. B: Condens. Mater 49, 2030 (1994).
10. W.J. Boettinger, et al., Acta Mater. 53, 5033 (2005).
11. Pearson Handbook of Crystallographic Data for Intermetallic Phases, 2nd ed. (Materials Park, OH: ASM International, 1991).
12. Binary Alloy Phase Diagrams, 2nd ed., ed, Massalski (Materials Park, OH: ASM International, 1990), vol. 3, p. 3411.
13. U.R. Kattner (unpublished research, NIST, 2005).
14. A.J. Bard, and L.R. Faulkner, Electrochemical Methods: Fundamentals and Applications 2nd ed. in (New York: Wiley, 2001), p. 337.
15. R. Anderson and S.J. Klepeis, In: Practical Aspects of FIB TEM Specimen Preparation, Introduction to Focused Ion Beams; Instrumentation, Theory, Techniques and Practice, ed. L. Giannuzzi and F. Stevie (New York: Springer, 2005), pp, 173-200.
16. G.T. Sheng, C.F. Hu, W.J. Choi, K.N. Tu, Y.Y. Bong, and L. Nguyen, J. Appl. Phys. 92, 64 (2002).