Effects of N2 protection on wettability of Sn-Cu-Ni-Ce lead-free solder

Hanjie Xuebao/Transactions of the China Welding Institution

Volumn 28, Issue 1, 2007, Pages 49-52

  Wang, Jian Xin ^a   Xue, Song Bai ^a   Huang, Xiang ^a   Han, Zong Jie ^a   Yu, Sheng Lin ^a,b  

^a NANJING UNIVERSITY OF AERONAUTICS AND ASTRONAUTICS   (China)

^b CHINA ELECTRONICS TECHNOLOGY GROUP CORPORATION   (China)

Author keywords

Ce; Lead free solder; Sn Cu Ni Ce solder; Wettability

Indexed keywords

CERIUM; PROTECTIVE ATMOSPHERES; SURFACE TENSION; WETTING;

INTERFACIAL TENSION; LEAD FREE SOLDER; WETTABILITY; WETTING BALANCE TESTING;

SOLDERING ALLOYS;

EID: 33947522208     PISSN: 0253360X     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (10)

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4. Wu C M L, Yu Da-quan, Law C M T, et al. Microstructure and mechanical properties of new lead-free Sn-Cu-RE solder alloys[J]. Journal of Electronic Materials, 2002, 31(9): 928-932.
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