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Materials Transactions

Volumn 43, Issue 2, 2002, Pages 239-245

Effect of Au addition on microstructural and mechanical properties of Sn-Cu eutectic solder

(3) Huh, Seok Hwan a Kim, Keun Soo a Suganuma, Katsuaki a

a OSAKA UNIVERSITY (Japan)

Author keywords

Gold addition; Lead free; Microstructure; Soldering; Tensile stress; Tin copper

Indexed keywords

BINARY ALLOYS; DIFFERENTIAL SCANNING CALORIMETRY; GOLD; INTERMETALLICS; MICROSTRUCTURE; PRECIPITATION (CHEMICAL); SOLDERING ALLOYS; SOLID SOLUTIONS; STRESS ANALYSIS; TENSILE STRENGTH; TENSILE STRESS; TIN ALLOYS;

EUTECTIC ALLOYS;

EUTECTICS;

EID: 0036475652 PISSN: 13459678 EISSN: None Source Type: Journal
DOI: 10.2320/matertrans.43.239 Document Type: Conference Paper

Times cited : (27)

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