Optimal conditions for the wetting balance test

Journal of Materials Processing Technology

Volumn 209, Issue 6, 2009, Pages 3089-3095

  Martorano, K M ^a   Martorano, M A ^a   Brandi, S D ^a  

^a UNIVERSITY OF SÃO PAULO   (Brazil)

Author keywords

Soldering; Spreading; Wetting balance

Indexed keywords

BRAZING; TIN; TITANIUM COMPOUNDS; WELDING;

BATH TEMPERATURES; COPPER SHEETS; OPTIMAL CONDITIONS; SHEET THICKNESS; SPREADING; STANDARD CURVES; WETTING BALANCE; WETTING FORCES; WETTING PARAMETERS; WETTING RATES; WETTING TESTS;

WETTING;

EID: 61349087317     PISSN: 09240136     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jmatprotec.2008.07.015     Document Type: Article

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