Electromigration in Sn-Cu intermetallic compounds

Journal of Applied Physics

Volumn 105, Issue 2, 2009, Pages

  Wei, C C ^a   Chen, C F ^a   Liu, P C ^a   Chen, Chih ^a  

^a NATIONAL CHIAO TUNG UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; ELECTROMIGRATION; INTERMETALLICS; SEMICONDUCTING INTERMETALLICS; SOLDERING ALLOYS;

CRITICAL LENGTHS; CU COMPOUNDS; CU INTERMETALLICS; EDGE DISPLACEMENTS; ELECTROMIGRATION BEHAVIORS; ELECTROMIGRATION RESISTANCES; INTERMETALLIC COMPOUNDS; SN-AG-CU SOLDERS; SOLIDUS TEMPERATURES;

TIN;

EID: 59349118938     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.3072662     Document Type: Article

References (12)

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