Rare-earth additions to lead-free electronic solders

Journal of Materials Science: Materials in Electronics

Volumn 18, Issue 1-3, 2007, Pages 77-91

  Wu, C M Lawrence ^a   Wong, Y W ^a  

^a CITY UNIVERSITY OF HONG KONG   (Hong Kong)

Author keywords

[No Author keywords available]

Indexed keywords

BINARY ALLOYS; CREEP; INTERMETALLICS; RARE EARTH ALLOYS; RELIABILITY; TENSILE STRENGTH; TERNARY SYSTEMS; TIN ALLOYS;

BALL GRID ARRAY (BGA); LEAD-FREE ELECTRONIC SOLDERS; SOLDER BALLS;

SOLDERING ALLOYS;

EID: 33845716824     PISSN: 09574522     EISSN: 1573482X     Source Type: Journal    
DOI: 10.1007/s10854-006-9022-6     Document Type: Article

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