Wetting kinetics of eutectic lead and lead-free solders: Spreading over the Cu surface

Journal of Electronic Materials

Volumn 38, Issue 2, 2009, Pages 284-291

  Zhao, Hui ^a   Nalagatla, Dinesh Reddy ^a,b   Sekulic, Dusan P ^a  

^a Center for Manufacturing   (United States)

^b UNIVERSITY OF KENTUCKY   (United States)

Author keywords

Lead free and lead solders; Soldering; Wetting

Indexed keywords

CONTROLLED ATMOSPHERES; CU SURFACES; EARLY STAGES; IN SITU MONITORING; LEAD-FREE AND LEAD SOLDERS; LEAD-FREE SOLDERS; MICROSCOPY SYSTEMS; SPREADING RATES; TWO STAGES; WETTING KINETICS;

BRAZING; COPPER; EUTECTICS; SCANNING ELECTRON MICROSCOPY; SILVER; SOLDERING; SOLDERING ALLOYS; TIN; WELDING; WETTING;

LEAD;

EID: 58349096456     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-008-0590-5     Document Type: Article

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