Nickel-stabilized hexagonal (Cu, Ni)6Sn5 in Sn-Cu-Ni lead-free solder alloys

Scripta Materialia

Volumn 59, Issue 2, 2008, Pages 191-194

  Nogita, Kazuhiro ^a   Nishimura, Tetsuro ^b  

^a UNIVERSITY OF QUEENSLAND   (Australia)

^b School of Materials Engineering   (Japan)

Author keywords

Intermetallic compound; Phase transformation; Solder; Transmission electron microscopy

Indexed keywords

COPPER COMPOUNDS; CRYSTAL STRUCTURE; INTERMETALLICS; THERMAL EFFECTS; TRANSMISSION ELECTRON MICROSCOPY;

ALLOTROPIC TRANSFORMATION; LEAD-FREE SOLDER ALLOYS; ROOM TEMPERATURE;

SOLDERING ALLOYS;

EID: 43449092170     PISSN: 13596462     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.scriptamat.2008.03.002     Document Type: Article

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