Interfacial reaction between Sn-rich solders and Ni-based metallization

Thin Solid Films

Volumn 462-463, Issue SPEC. ISS., 2004, Pages 387-394

  He, M ^a   Kumar, A ^a   Yeo, P T ^a   Qi, G J ^b   Chen, Z ^a  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

^b SINGAPORE INSTITUTE OF MANUFACTURING TECHNOLOGY   (Singapore)

Author keywords

Electroless nickel; Intermetallic compound; Solder; Thermal aging

Indexed keywords

ELECTROLESS NICKEL; REFLOW; UNDER BUMP METALLIZATION (UBM);

ACTIVATION ENERGY; AGING OF MATERIALS; INTERMETALLICS; METALLIZING; NICKEL; SOLDERING; SURFACE CHEMISTRY;

TIN;

EID: 4344575993     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tsf.2004.05.062     Document Type: Article

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