Microcreep of rapidly solidified Sn-0.7 wt.% Cu-In solder alloys

Materials Science and Engineering: A

Volumn 456, Issue 1-2, 2007, Pages 1-4

  Kamal, Mustafa ^a   El Ashram, Tarek ^b  

^a Mansoura University   (Egypt)

^b PORT SAID UNIVERSITY   (Egypt)

Author keywords

Microcreep; Microhardness; Rapid solidification; Resistivity; X ray diffraction; Young's modulus

Indexed keywords

CREEP; CREEP RESISTANCE; ELASTIC MODULI; EUTECTICS; MICROHARDNESS; RAPID SOLIDIFICATION; SOLDERING ALLOYS; X RAY DIFFRACTION ANALYSIS;

EUTECTIC ALLOY; MICROCREEP; SOLDER ALLOYS;

COPPER ALLOYS;

COPPER ALLOYS; CREEP; CREEP RESISTANCE; ELASTIC MODULI; EUTECTICS; MICROHARDNESS; RAPID SOLIDIFICATION; SOLDERING ALLOYS; X RAY DIFFRACTION ANALYSIS;

EID: 33947402725     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.msea.2007.01.056     Document Type: Article

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