-
1
-
-
56549109155
-
Whiskers caused satellite failure: Galaxy IV outage blamed on interstellar phenomenon
-
May 17
-
B. Felps: Whiskers caused satellite failure: Galaxy IV outage blamed on interstellar phenomenon. Wireless Week, May 17, 1999.
-
(1999)
Wireless Week
-
-
Felps, B.1
-
2
-
-
1542313711
-
Air Force links radar problems to growth of tin whiskers
-
June 30
-
B.D. Nordwall: Air Force links radar problems to growth of tin whiskers. Aviation Week and Space Technology, June 30, 1986, pp. 65-68.
-
(1986)
Aviation Week and Space Technology
, pp. 65-68
-
-
Nordwall, B.D.1
-
5
-
-
1542283555
-
Tin whiskers: Attributes and mitigation
-
March 25-29
-
J.A. Brusse, G.J. Ewell, and J.P. Siplon: Tin whiskers: Attributes and mitigation, in Proceedings of the 22nd Capacitor and Resistor Technology Symposium, March 25-29, 2002, pp. 67-80.
-
(2002)
Proceedings of the 22nd Capacitor and Resistor Technology Symposium
, pp. 67-80
-
-
Brusse, J.A.1
Ewell, G.J.2
Siplon, J.P.3
-
6
-
-
0006041570
-
Growth of metal whiskers from the solid
-
edited by R.H. Doremus, B.W. Roberts, and D. Turnbull John Wiley & Sons, New York
-
W.C. Ellis, D.F. Gibbons, and R.C. Treuting: Growth of metal whiskers from the solid, in Growth and Perfection of Crystals, edited by R.H. Doremus, B.W. Roberts, and D. Turnbull (John Wiley & Sons, New York, 1958), pp. 102-120.
-
(1958)
Growth and Perfection of Crystals
, pp. 102-120
-
-
Ellis, W.C.1
Gibbons, D.F.2
Treuting, R.C.3
-
7
-
-
0016073268
-
Spontaneous growth of whiskers on tin coatings: 20 years of observation
-
S.C. Britton: Spontaneous growth of whiskers on tin coatings: 20 years of observation. Trans. Inst. Met. Finish. 52, 95 (1974).
-
(1974)
Trans. Inst. Met. Finish.
, vol.52
, pp. 95
-
-
Britton, S.C.1
-
8
-
-
0016544277
-
Observations on the growth of whisker crystals from zinc electroplate
-
U. Lindborg: Observations on the growth of whisker crystals from zinc electroplate. Metall. Trans. A 6, 1581 (1975).
-
(1975)
Metall. Trans. A
, vol.6
, pp. 1581
-
-
Lindborg, U.1
-
9
-
-
0016921629
-
A model for the spontaneous growth of zinc, cadmium and tin whiskers
-
U. Lindborg: A model for the spontaneous growth of zinc, cadmium and tin whiskers. Acta Metall. 24, 181 (1976).
-
(1976)
Acta Metall.
, vol.24
, pp. 181
-
-
Lindborg, U.1
-
10
-
-
46149152722
-
Understanding whisker phenomenon: Whisker index and tin/copper, tin/ nickel interface
-
New Orleans, LA
-
Y. Zhang, C. Xu, C. Fan, J. Abys, and A. Vysotskaya: Understanding whisker phenomenon: Whisker index and tin/copper, tin/ nickel interface, in Proceedings of the IPC SMEMA APEX Conference, New Orleans, LA (2002), pp. S06-1-1-S06-1-10.
-
(2002)
Proceedings of the IPC SMEMA APEX Conference
-
-
Zhang, Y.1
Xu, C.2
Fan, C.3
Abys, J.4
Vysotskaya, A.5
-
11
-
-
0032083872
-
Spontaneous growth mechanism of tin whiskers
-
B.Z. Lee and D.N. Lee: Spontaneous growth mechanism of tin whiskers. Acta Metall. 46, 3701 (1998).
-
(1998)
Acta Metall.
, vol.46
, pp. 3701
-
-
Lee, B.Z.1
Lee, D.N.2
-
12
-
-
26844565117
-
Whisker and Hillock formation on Sn, Sn-Cu and Sn-Pb electrodeposits
-
W.J. Boettinger, C.E. Johnson, L.A. Bendersky, and K.-W. Moon, M.E. Williams, and G.R. Stafford: Whisker and Hillock formation on Sn, Sn-Cu and Sn-Pb electrodeposits. Acta Mater. 53, 5033 (2005).
-
(2005)
Acta Mater.
, vol.53
, pp. 5033
-
-
Boettinger, W.J.1
Johnson, C.E.2
Bendersky, L.A.3
Moon, K.-W.4
Williams, M.E.5
Stafford, G.R.6
-
13
-
-
43049107171
-
Whisker formation in Sn and Pb-Sn coatings: Role of intermetallic growth, stress evolution and plastic deformation processes
-
E. Chason, N. Jadhav, W.L. Chan, L. Reinbold, and K.S. Kumar: Whisker formation in Sn and Pb-Sn coatings: Role of intermetallic growth, stress evolution and plastic deformation processes. Appl. Phys. Lett. 92, 171901 (2008).
-
(2008)
Appl. Phys. Lett.
, vol.92
, pp. 171901
-
-
Chason, E.1
Jadhav, N.2
Chan, W.L.3
Reinbold, L.4
Kumar, K.S.5
-
14
-
-
0242439532
-
Tin whiskers studied by synchrotron radiation scanning x-ray micro-diffraction
-
W.J. Choi, T.Y. Lee, K.N. Tu, N. Tamura, R.S. Celestre, A.A. MacDowell, Y.Y. Bong, and L. Nguyen: Tin whiskers studied by synchrotron radiation scanning x-ray micro-diffraction. Acta Mater. 51, 6253 (2003).
-
(2003)
Acta Mater.
, vol.51
, pp. 6253
-
-
Choi, W.J.1
Lee, T.Y.2
Tu, K.N.3
Tamura, N.4
Celestre, R.S.5
MacDowell, A.A.6
Bong, Y.Y.7
Nguyen, L.8
-
15
-
-
47249100191
-
Driving force for Sn whisker growth in the system Cu-Sn
-
M. Sobiech, U. Welzel, E.J. Mittemeijer, W. Hügel, and A. Seekamp: Driving force for Sn whisker growth in the system Cu-Sn. Appl. Phys. Lett. 93, 011906 (2008).
-
(2008)
Appl. Phys. Lett.
, vol.93
, pp. 011906
-
-
Sobiech, M.1
Welzel, U.2
Mittemeijer, E.J.3
Hügel, W.4
Seekamp, A.5
-
16
-
-
20444415285
-
Investigation of Sn-Cu intermetallic compounds by AFM: New aspects of the role of intermetallic compounds in whisker formation
-
W. Zhang, A. EgIi, F. Schwager, and N. Brown: Investigation of Sn-Cu intermetallic compounds by AFM: New aspects of the role of intermetallic compounds in whisker formation. IEEE Trans. Electron. Packag. Manuf. 28, 85 (2005).
-
(2005)
IEEE Trans. Electron. Packag. Manuf.
, vol.28
, pp. 85
-
-
Zhang, W.1
Egii, A.2
Schwager, F.3
Brown, N.4
-
17
-
-
20444399302
-
Understanding whisker phenomenon-part II: Competitive mechanisms
-
edited by R.G. Baker NASF, Washington, DC
-
C. Xu, C. Fan, A. Vysotskova, J. Abys, Y. Zhang, L. Hopkins, and F. Stevie: Understanding whisker phenomenon-part II: Competitive mechanisms, in Proceedings of the AESF SURIFIN 2001, edited by R.G. Baker (NASF, Washington, DC, 2001), pp. 211-216.
-
(2001)
Proceedings of the AESF SURIFIN 2001
, pp. 211-216
-
-
Xu, C.1
Fan, C.2
Vysotskova, A.3
Abys, J.4
Zhang, Y.5
Hopkins, L.6
Stevie, F.7
-
18
-
-
0036640490
-
Tin whiskers studied by focused ion beam imaging and transmission electron microscopy
-
G.T.T. Sheng, C.F. Hu, W.J. Choi, K.N. Tu, Y.Y. Bong, and L. Nguyen: Tin whiskers studied by focused ion beam imaging and transmission electron microscopy. J. Appl. Phys. 92, 64 (2002).
-
(2002)
J. Appl. Phys.
, vol.92
, pp. 64
-
-
Sheng, G.T.T.1
Hu, C.F.2
Choi, W.J.3
Tu, K.N.4
Bong, Y.Y.5
Nguyen, L.6
-
19
-
-
0038012575
-
Tin whisker formation: Results, test methods and countermeasures
-
New Orleans, LA
-
M. Dittes, P. Oberndorff, and L. Petit: Tin whisker formation: Results, test methods and countermeasures, in Proceedings of the 53rd Electronic Components & Technology Conference, New Orleans, LA (2003), pp. 822-826.
-
(2003)
Proceedings of the 53rd Electronic Components & Technology Conference
, pp. 822-826
-
-
Dittes, M.1
Oberndorff, P.2
Petit, L.3
-
20
-
-
56549120155
-
Plastic deformation processes in Cu/Sn bimetallic films
-
K.S. Kumar, L. Reinbold, A.F. Bower, and E. Chason: Plastic deformation processes in Cu/Sn bimetallic films. J. Mater. Res. 23, 2916 (2008).
-
(2008)
J. Mater. Res.
, vol.23
, pp. 2916
-
-
Kumar, K.S.1
Reinbold, L.2
Bower, A.F.3
Chason, E.4
-
21
-
-
0020125253
-
Kinetics of interfacial reaction in bimetallic Cu-Sn thin films
-
K.N. Tu and R.D. Thompson: Kinetics of interfacial reaction in bimetallic Cu-Sn thin films. Ada Metall. 30, 947 (1982).
-
(1982)
Ada Metall.
, vol.30
, pp. 947
-
-
Tu, K.N.1
Thompson, R.D.2
-
22
-
-
0000643191
-
Irreversible processes of spontaneous whisker growth in bimetallic Cu-Sn thin film reactions
-
K.N. Tu: Irreversible processes of spontaneous whisker growth in bimetallic Cu-Sn thin film reactions. Phys. Rev. B 49, 2030 (1994).
-
(1994)
Phys. Rev. B
, vol.49
, pp. 2030
-
-
Tu, K.N.1
-
23
-
-
0001085508
-
The elastic field outside an ellipsoidal inclusion
-
J.D. Eshelby: The elastic field outside an ellipsoidal inclusion. Proc. R. Soc. London, Ser. A 252, 561 (1959).
-
(1959)
Proc. R. Soc. London, Ser. A
, vol.252
, pp. 561
-
-
Eshelby, J.D.1
-
24
-
-
0036297033
-
Reliability issues of Pb-free solder joints in electronic packaging technology
-
San Diego, CA
-
K.N. Tu and K. Zeng: Reliability issues of Pb-free solder joints in electronic packaging technology, in Proc. 52nd IEEE Elect. Comp. & Tech. Conf., San Diego, CA (2002), pp. 1194-1199.
-
(2002)
Proc. 52nd IEEE Elect. Comp. & Tech. Conf.
, pp. 1194-1199
-
-
Tu, K.N.1
Zeng, K.2
-
26
-
-
48149111322
-
Pressureinduced tin whisker formation
-
T. Shibutani, Q. Yu, M. Shiratori, and M.G. Pecht: Pressureinduced tin whisker formation. Microeledron. Reliab. 48, 1033 (2008).
-
(2008)
Microeledron. Reliab.
, vol.48
, pp. 1033
-
-
Shibutani, T.1
Yu, Q.2
Shiratori, M.3
Pecht, M.G.4
-
27
-
-
84925538323
-
Tin whisker formation in thermal cycling conditions
-
EPTC
-
M. Dittes, P. Oberndorff, P. Crema, and V. Schroeder: Tin whisker formation in thermal cycling conditions, in Proceedings of Electronics Packaging Technology, 2003 5th Conference (EPTC, 2003), p. 183.
-
(2003)
Proceedings of Electronics Packaging Technology, 2003 5th Conference
, pp. 183
-
-
Dittes, M.1
Oberndorff, P.2
Crema, P.3
Schroeder, V.4
-
29
-
-
84982346004
-
Measurement of grain boundary selfdiffusion in polycrystalline tin
-
W. Lange and D. Bergner: Measurement of grain boundary selfdiffusion in polycrystalline tin. Phys. Status Solidi 2, 1410 (1962).
-
(1962)
Phys. Status Solidi
, vol.2
, pp. 1410
-
-
Lange, W.1
Bergner, D.2
-
30
-
-
0034712068
-
Superplastic extensibility of nanocrystalline Cu at room temperature
-
L. Lu, M.L. Sui, and K. Lu: Superplastic extensibility of nanocrystalline Cu at room temperature. Science 287, 1463 (2000).
-
(2000)
Science
, vol.287
, pp. 1463
-
-
Lu, L.1
Sui, M.L.2
Lu, K.3
-
32
-
-
4644234025
-
Transition from strengthening to softening by grain boundaries in ultrafine-grained Cu
-
Y.J. Li, X.H. Zeng, and W. Blum: Transition from strengthening to softening by grain boundaries in ultrafine-grained Cu. Acta Mater. 52, 5009 (2004).
-
(2004)
Acta Mater.
, vol.52
, pp. 5009
-
-
Li, Y.J.1
Zeng, X.H.2
Blum, W.3
-
33
-
-
0026888138
-
Quasi-static intergranular cracking in a Cu/ IbSn alloy; An analog of stress relief cracking of steels
-
E.V. Barrera, M. Menyhard, D. Bika, B. Rothman, and C.J. McMahon, Jr.: Quasi-static intergranular cracking in a Cu/ IbSn alloy; An analog of stress relief cracking of steels. Scr. Metall. 27, 205 (1992).
-
(1992)
Scr. Metall.
, vol.27
, pp. 205
-
-
Barrera, E.V.1
Menyhard, M.2
Bika, D.3
Rothman, B.4
McMahon Jr., C.J.5
-
34
-
-
0032673128
-
Sn-induced dynamic embrittlement of Cu-7%Sn bicrystals with a Σ5 boundary
-
R.C. Muthiah, J.A. Pfaendtner, S. Ishikawa, and C.J. McMahon, Jr.: Sn-induced dynamic embrittlement of Cu-7%Sn bicrystals with a Σ5 boundary. Acta Mater. 47, 2797 (1999).
-
(1999)
Acta Mater.
, vol.47
, pp. 2797
-
-
Muthiah, R.C.1
Pfaendtner, J.A.2
Ishikawa, S.3
McMahon Jr., C.J.4
-
35
-
-
0035802568
-
Dynamic embrittlement of Cu-Sn bicrystals grown from the melt
-
S.W. Wood and C.J. McMahon, Jr.: Dynamic embrittlement of Cu-Sn bicrystals grown from the melt. Scr. Mater. 45, 1307 (2001).
-
(2001)
Scr. Mater.
, vol.45
, pp. 1307
-
-
Wood, S.W.1
McMahon Jr., C.J.2
-
36
-
-
34147160637
-
Evidence for the intergranular segregation of tin to the grain boundaries of a Cu-Sn alloy and its consequences for dynamic embrittlement
-
X.Y. Liu, D. Tham, D. Yates, and C.J. McMahon, Jr.: Evidence for the intergranular segregation of tin to the grain boundaries of a Cu-Sn alloy and its consequences for dynamic embrittlement. Mater. Sci. Eng., A 458, 123 (2007).
-
(2007)
Mater. Sci. Eng., A
, vol.458
, pp. 123
-
-
Liu, X.Y.1
Tham, D.2
Yates, D.3
McMahon Jr., C.J.4
-
37
-
-
0346973309
-
On the suppression of dynamic embrittlement in Cu-8wt.% Sn by an addition of Zirconium
-
X.Y. Liu, W. Kane, and C.J. McMahon, Jr.: On the suppression of dynamic embrittlement in Cu-8wt.% Sn by an addition of Zirconium. Scr. Mater. 50, 673 (2004).
-
(2004)
Scr. Mater.
, vol.50
, pp. 673
-
-
Liu, X.Y.1
Kane, W.2
McMahon Jr., C.J.3
-
38
-
-
0019031617
-
Effects of hydrogen on the properties of iron and steel
-
J.P. Hirth: Effects of hydrogen on the properties of iron and steel. Metall. Trans. A 11, 861 (1980).
-
(1980)
Metall. Trans. A
, vol.11
, pp. 861
-
-
Hirth, J.P.1
|