Melting temperature depression of Sn-0.4Co-0.7Cu lead-free solder nanoparticles

Soldering and Surface Mount Technology

Volumn 21, Issue 2, 2009, Pages 9-13

  Zou, C D ^a   Gao, Y L ^a   Yang, B ^a   Zahi, Q J ^a   Andersson, C ^b   Liu, J ^a,b  

^a SHANGHAI UNIVERSITY   (China)

^b CHALMERS UNIVERSITY OF TECHNOLOGY   (Sweden)

Author keywords

Alloys; Lead; Melting point; Nanotechnology; Solders

Indexed keywords

BULK ALLOYS; COST ADVANTAGES; CRYSTAL STRUCTURE AND MORPHOLOGY; DESIGN/METHODOLOGY/APPROACH; DIRECT CURRENT; FIELD EMISSION SCANNING ELECTRON MICROSCOPES; LEAD FREE SOLDERS; LEAD-FREE SOLDER ALLOY; MELTING TEMPERATURES; PURE METALS; SN-37PB; SN-AG-CU; SOLDERS; ULTRASONIC VIBRATION;

ALLOYS; COPPER ALLOYS; CRYSTAL STRUCTURE; DIFFERENTIAL SCANNING CALORIMETRY; FIELD EMISSION; LEAD; METAL MELTING; NANOPARTICLES; NANOTECHNOLOGY; SCANNING ELECTRON MICROSCOPY; SILVER; SMELTING; SOLDERING ALLOYS; STEELMAKING; TIN; TIN ALLOYS; ULTRASONIC TESTING; X RAY DIFFRACTION ANALYSIS;

MELTING POINT;

EID: 70349206195     PISSN: 09540911     EISSN: None     Source Type: Journal    
DOI: 10.1108/09540910910947417     Document Type: Article

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