Wetting in soldering and microelectronics

Annual Review of Materials Research

Volumn 38, Issue , 2008, Pages 251-273

  Matsumoto, T ^a   Nogi, K ^a  

^a OSAKA UNIVERSITY   (Japan)

Author keywords

Contact angle; Sessile drop method; Wetting balance method; Wetting force

Indexed keywords

ALLOYS; BRAZING; CONTACT ANGLE; COPPER; LEAD; METALLIC COMPOUNDS; METALS; MICROELECTRONICS; SILVER; SILVER ALLOYS; TIN ALLOYS; WELDING; WETTING; ZINC;

BASE ALLOYS; CONTACT ANGLES; MOLTEN SOLDERS; SESSILE DROP METHOD; SOLID METALS; WETTING BALANCE METHOD; WETTING FORCE; WETTING FORCES; WETTING RATES;

TIN;

EID: 50249147376     PISSN: 15317331     EISSN: None     Source Type: Book Series    
DOI: 10.1146/annurev.matsci.38.060407.132448     Document Type: Article

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