Effect of adding 0.3 wt% Ni into the Sn-0.7 wt% Cu solder. Part II. Growth of intermetallic layer with Cu during wetting and aging

Journal of Alloys and Compounds

Volumn 438, Issue 1-2, 2007, Pages 122-128

  Rizvi, M J ^a   Bailey, C ^a   Chan, Y C ^b   Islam, M N ^b   Lu, H ^a  

^a UNIVERSITY OF GREENWICH   (United Kingdom)

^b CITY UNIVERSITY OF HONG KONG   (Hong Kong)

Author keywords

Aging; Intermetallic compound layer; Solder; Wetting

Indexed keywords

AGING OF MATERIALS; COPPER; DIFFUSION COATINGS; INTERMETALLICS; SOLDERING; SUBSTRATES; WETTING;

DIFFUSION-CONTROLLED MECHANISM; INTERMETALLIC COMPOUND LAYER; INTERMETALLIC LAYER GROWTH;

SEMICONDUCTOR GROWTH;

EID: 34247609844     PISSN: 09258388     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jallcom.2006.08.071     Document Type: Article

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