Resonant characteristics of the microelectronic Sn-Cu solder

Journal of Alloys and Compounds

Volumn 457, Issue 1-2, 2008, Pages 171-176

  Hung, Fei Yi ^a   Lui, Truan Sheng ^a   Chen, Li Hui ^a   He, Nien Ting ^a  

^a NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

Author keywords

Lamellar deformed structures (LDS); Lead free solder; Microelectronic; Resonant; Sn Cu

Indexed keywords

CRACK PROPAGATION; INTERMETALLICS; LAMELLAR STRUCTURES; MICROELECTRONICS; RESONANCE; TIN ALLOYS;

LAMELLAR DEFORMED STRUCTURES (LDS); LEAD FREE SOLDER; SN RICH PHASE FINER; VIBRATION DEFORMATION MECHANISMS;

BINARY ALLOYS;

EID: 42649108766     PISSN: 09258388     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jallcom.2007.03.026     Document Type: Article

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