Lead-free soldering: Materials science and solder joint reliability

JOM

Volumn 61, Issue 6, 2009, Pages 28-

  Zeng, Kejun ^a,b  

^a TEXAS INSTRUMENTS   (United States)

^b Electronic Magnetic and Photonic Materials Division of TMS   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 70349728579     PISSN: 10474838     EISSN: 15431851     Source Type: Journal    
DOI: 10.1007/s11837-009-0084-9     Document Type: Note

References (4)

1. T. Costlow, EE Times (24 January 2000).
2. J.G. Lee and K.N. Subramanian, Microelectr. Reliab., 47 (2007), pp. 118-131.
3. T.T. Mattila and J.K. Kivilahti, J. Electr. Mater., 35 (2006), pp. 250-256.
4. F. Song et al., Proc. 9th Electr. Packag. Technol. Conf. (Piscataway, NJ: IEEE, 2007), pp. 463-470.