SCOPUS 정보 검색 플랫폼

Journal of Electronic Materials

Volumn 31, Issue 5, 2002, Pages 442-448

Creep behavior of eutectic Sn-Cu lead-free solder alloy

(2) Wu, C M L a Huang, M L b

a CITY UNIVERSITY OF HONG KONG (Hong Kong)

b DALIAN UNIVERSITY OF TECHNOLOGY (China)

Author keywords

Activation energy; Creep; Eutectic Sn Cu; Lead free solder alloy; Precipitation strengthening

Indexed keywords

ACTIVATION ENERGY; COPPER; CREEP; CRYSTAL MICROSTRUCTURE; ELASTIC MODULI; EUTECTICS; INTERMETALLICS; PRECIPITATION (CHEMICAL); RELAXATION PROCESSES; THERMAL EFFECTS; TIN COMPOUNDS;

LEAD-FREE SOLDER ALLOYS;

SOLDERING ALLOYS;

EID: 0036575144 PISSN: 03615235 EISSN: None Source Type: Journal
DOI: 10.1007/s11664-002-0098-3 Document Type: Article

Times cited : (72)

References (21)

1
- 0004206712
- New York: Elsevier
- (1988) Creep in Metallic Materials , pp. 44-58
- Čadek, J.¹

2
- 0032154902
- (1998) J. Mater. Sci. , vol.33 , pp. 4503
- Raeder, C.H.¹ Mitlin, D.² Messler, R.W.³

3
- 0034206842
- (2000) JOM , vol.52 , pp. 33
- McCabe, R.J.¹ Fine, M.E.²

4
- 38749086722
- (1982) Strength of Metals and Alloys: Proc. 6th Int. Conf. , vol.1105 , pp. 1105
- Langdon, T.G.¹

5
- 0018439649
- (1979) Acta Metall. , vol.27 , pp. 387
- Sherby, O.D.¹ Weertman, J.²

6
- 0029289262
- (1995) Mater. Sci. Eng. , vol.A194 , pp. 17
- Adeva, P.¹ Caruanan, G.² Ruano, O.A.³ Torralba, M.⁴

7
- 0015617542
- (1993) Metall. Trans. , vol.4 , pp. 935
- Mohamed, F.A.¹ Murty, K.L.² Morris, J.W.³

8
- 0001670969
- (1955) JOM , vol.72 , pp. 1230
- Breen, J.E.¹ Weertman, J.²

9
- 0026835567
- (1992) J. Mater. Res. , vol.7 , pp. 627
- Raman, V.¹ Berriche, R.²

10
- 0009530874
- (1992) IEEE Trans. Components, Hybrids Manuf. Technol. , vol.15 , pp. 1018
- Darveaux, R.¹

11
- 0002014773
- eds. R.S. Mishra, A.K. Murherjee, and K.L. Murty (Warrendale, PA: TMS)
- (1999) Creep Behavior of Advanced Materials for the 21st Century , pp. 51
- Mathew, M.D.¹ Mova, S.² Yang, H.³ Murty, K.L.⁴

12
- 0000690104
- (1960) Trans. Metall. Soc. , vol.218 , pp. 463
- Meakin, J.D.¹ Klokholm, E.²

13
- 0033905429
- (2000) J. Electron. Mater. , vol.29 , pp. 244
- Igoshev, V.I.¹ Kleiman, J.I.²

14
- 0003752969
- New York: Van Nostrand Reinhold
- (1993) The Mechanics of Solder Alloy Interconnections , pp. 61
- Frear, D.R.¹ Burchett, S.N.² Morgan, H.S.³ Lau, J.H.⁴

15
- 0039853925
- (1986) Acta Metall. , vol.34 , pp. 1893
- Artz, E.¹ Wilkinson, D.S.²

16
- 0023997880
- (1988) Acta Metall. , vol.36 , pp. 1053
- Artz, E.¹ Rösler, J.²

17
- 0031257872
- (1997) Scripta Mater. , vol.37 , pp. 1039
- Čadek, J.¹ Milika, K.²

18
- 0033570578
- (1999) Mater. Sci. Eng. , vol.A272 , pp. 45
- Čadek, J.¹ Kuchaová, K.² Zhu, S.J.³

19
- 0031275679
- (1997) Acta Mater. , vol.45 , pp. 4775
- Li, Y.¹ Nutt, S.R.² Mohamed, F.A.³

20
- 0002945767
- ed. H.I. Aaronson (Metals Park, OH: ASM)
- (1973) Diffusion , pp. 241
- Gjostein, N.A.¹

21
- 0001339073
- (1961) Trans. ASM , vol.54 , pp. 227
- Sherby, D.¹ Simnad, M.T.²

* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.