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Journal of Materials Science: Materials in Electronics

Volumn 22, Issue 8, 2011, Pages 1130-1135

Thermodynamic analysis and characterization of Bi-Cu-Sn alloys as advanced lead-free solder materials for high temperature application

(6) Živković, Dragana a Minić, Duško b Manasijević, Dragan a Talijan, Nadežda c Katayama, Iwao d Kostov, Ana e

a UNIVERSITY OF BELGRADE (Serbia)

b UNIVERSITY OF PRI TINA (Serbia)

c UNIVERSITY OF BELGRADE (Serbia)

d OSAKA UNIVERSITY (Japan)

e Mining and Metallurgy Institute (Serbia)

Author keywords

[No Author keywords available]

Indexed keywords

ANALYTICAL INVESTIGATIONS; ELECTROCONDUCTIVITY; EXPERIMENTAL INVESTIGATIONS; GENERAL SOLUTIONS; LEAD-FREE SOLDER MATERIALS; MOLAR RATIO; SUBSTRATE MATERIAL; TEMPERATURE RANGE; THERMO DYNAMIC ANALYSIS;

CHARACTERIZATION; COPPER ALLOYS; DIFFERENTIAL SCANNING CALORIMETRY; DIFFERENTIAL THERMAL ANALYSIS; ELECTRIC CONDUCTIVITY; OPTICAL MICROSCOPY; PHASE EQUILIBRIA; SOLDERING ALLOYS; SUBSTRATES; TEMPERATURE; THERMODYNAMICS; TIN ALLOYS;

TIN;

EID: 80051545470 PISSN: 09574522 EISSN: 1573482X Source Type: Journal
DOI: 10.1007/s10854-010-0272-y Document Type: Article

Times cited : (9)

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