A model of Sn whisker growth by coupled plastic flow and grain boundary diffusion

Applied Physics Letters

Volumn 94, Issue 19, 2009, Pages

  Buchovecky, Eric J ^a   Du, Ningning ^a   Bower, Allan F ^a  

^a Brown University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ANALYTICAL MODEL; COLUMNAR GRAIN STRUCTURE; CU SUBSTRATE; DISLOCATION MOTION; EXPERIMENTAL MEASUREMENTS; FINITE ELEMENT SIMULATIONS; GRAIN-BOUNDARY DIFFUSION; INTERMETALLIC FORMATION; SN WHISKER; WHISKER GROWTH;

COPPER; FILM GROWTH; GRAIN BOUNDARIES; GRAIN SIZE AND SHAPE; PLASTIC FLOW; SIMULATORS; TIN; YIELD STRESS;

GRAIN GROWTH;

EID: 67049100743     PISSN: 00036951     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.3136865     Document Type: Article

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