Effects of Ce on spreadability of Sn-Cu-Ni lead-free solder and mechanical properties of soldered joints

Hanjie Xuebao/Transactions of the China Welding Institution

Volumn 28, Issue 11, 2007, Pages 73-77

  Shi, Yiping ^a   Xue, Songbai ^a   Wang, Jianxin ^a   Gu, Liyong ^b   Gu, Wenhua ^b  

^a NANJING UNIVERSITY OF AERONAUTICS AND ASTRONAUTICS   (China)

^b Changshu Huayin Filler Metals Co Ltd   (China)

Author keywords

Lead free solder; Mechanical properties; Microstructure; Sn Cu Ni Ce solder; Spreadability

Indexed keywords

CERIUM; COPPER ALLOYS; MECHANICAL PROPERTIES; METALLOGRAPHIC MICROSTRUCTURE; NICKEL ALLOYS; RARE EARTH ADDITIONS; SOLDERED JOINTS; TIN ALLOYS;

LEAD FREE SOLDER; SPREADABILITY; TIN COPPER NICKEL CERIUM SOLDER;

SOLDERING ALLOYS;

EID: 37149054756     PISSN: 0253360X     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (9)

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