Nanoindentation characterization of intermetallic compounds formed between Sn-Cu (-Ni) ball grid arrays and Cu substrates

Materials Science and Engineering: B

Volumn 164, Issue 1, 2009, Pages 44-50

  Tsukamoto, Hideaki ^a   Dong, Zhigang ^a   Huang, Han ^a   Nishimura, Tetsuro ^b   Nogita, Kazuhiro ^a  

^a UNIVERSITY OF QUEENSLAND   (Australia)

^b School of Materials Engineering   (Japan)

Author keywords

Intermetallic compound; Lead free solder; Mechanical property; Nanoindentation

Indexed keywords

BALL GRID ARRAYS; BINARY ALLOYS; COPPER; HARDNESS; INTERFACES (MATERIALS); INTERMETALLICS; LEAD-FREE SOLDERS; SOLDERED JOINTS; SOLDERING; SUBSTRATES; TIN ALLOYS;

BALL-GRID ARRAYS; CU LEADS; CU SUBSTRATE; INTERMETALLICS COMPOUNDS; MULTIPLE REFLOWS; NANO INDENTATION; NI ADDITIONS; SOLDER BALLS; SOLDER JOINTS; SUBSTRATE INTERFACE;

NANOINDENTATION;

EID: 67651151030     PISSN: 09215107     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mseb.2009.06.013     Document Type: Article

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