Formation of intermetallic compounds between liquid Sn and various CuNi x metallizations

Journal of Electronic Materials

Volumn 37, Issue 6, 2008, Pages 792-805

  Vuorinen, V ^a   Yu, H ^a   Laurila, T ^a   Kivilahti, J K ^a  

^a AALTO UNIVERSITY   (Finland)

Author keywords

Intermetallic formation; Kinetics; Lead free; Metastable solubility; Phase diagram; Reliability; Soldering; Solidification

Indexed keywords

COMPLEX REACTION LAYERS; INTERMETALLIC FORMATION; METASTABLE SOLUBILITY;

KINETICS; METALLIZING; PHASE COMPOSITION; PHASE DIAGRAMS; SOLIDIFICATION; SOLUBILITY; THICKNESS MEASUREMENT; TIN;

INTERMETALLICS;

EID: 42449112853     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-008-0411-x     Document Type: Article

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