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Volumn 46, Issue 5-6, 2006, Pages 846-849

Statistical analysis of tin whisker growth

Author keywords

[No Author keywords available]

Indexed keywords

BRASS; CRYSTAL GROWTH; LEAD ALLOYS; LEAKAGE CURRENTS; SEMICONDUCTOR MATERIALS; SHORT CIRCUIT CURRENTS; STATISTICAL METHODS; TIN ALLOYS;

EID: 33645136360     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2005.06.002     Document Type: Conference Paper
Times cited : (56)

References (14)
  • 1
    • 15744364842 scopus 로고    scopus 로고
    • CALCE EPSC Press University of Maryland, College Park (MD)
    • S. Ganesan, and M. Pecht Lead-free electronics 2004 CALCE EPSC Press University of Maryland, College Park (MD) Edition
    • (2004) Lead-free Electronics
    • Ganesan, S.1    Pecht, M.2
  • 2
    • 33645133154 scopus 로고    scopus 로고
    • Directive 2002/96/EC of the European Parliment and of the Council of 27 January 2003 on waste electrical and electronic equipment (WEEE)
    • European Union, Directive 2002/96/EC of the European Parliment and of the Council of 27 January 2003 on waste electrical and electronic equipment (WEEE), Official J Eur. Union, p. L37/24-38.
    • Official J Eur. Union
  • 3
    • 0038140902 scopus 로고    scopus 로고
    • Tin whisker observations on pure tin-plated ceramic chip capacitors
    • Orlando (FL), June
    • Brusse JA. Tin whisker observations on pure tin-plated ceramic chip capacitors. In: Proceedings of AESF SUR/FIN, Orlando (FL), June 2002. p. 45-61.
    • (2002) Proceedings of AESF SUR/FIN , pp. 45-61
    • Brusse, J.A.1
  • 7
    • 5444244980 scopus 로고    scopus 로고
    • Avoiding tin whisker reliability problems
    • G.T. Galyon, and R. Gedney Avoiding tin whisker reliability problems Circuits Assembly Aug 2004 26 31
    • (2004) Circuits Assembly , pp. 26-31
    • Galyon, G.T.1    Gedney, R.2
  • 8
    • 33645161897 scopus 로고    scopus 로고
    • NEMI Tin whisker user group-tin whisker acceptance test requirements
    • June 1-2 Las Vegas, NV
    • Smetana J. "NEMI Tin whisker user group-tin whisker acceptance test requirements", NEMI Tin Whisker Workshop, June 1-2, 2004, Las Vegas, NV.
    • (2004) NEMI Tin Whisker Workshop
    • Smetana, J.1
  • 10
    • 33645147238 scopus 로고    scopus 로고
    • NA-044 June 28, 2004
    • NASA, Parts advisory: tin whiskers, NA-044. Available from: http://nepp.nasa.gov/npsl/Prohibited/na-044.pdf, June 28, 2004.
    • Parts Advisory: Tin Whiskers
  • 11
    • 13444286539 scopus 로고
    • Whisker formations on electronic materials
    • B.D. Dunn Whisker formations on electronic materials Circuit World 2 4 1976 32 40
    • (1976) Circuit World , vol.2 , Issue.4 , pp. 32-40
    • Dunn, B.D.1
  • 13
    • 0001049586 scopus 로고
    • Growth mechanisms of proper tin-whisker
    • N. Furuta, and K. Hamamura Growth mechanisms of proper tin-whisker Jpn J Appl Phys 9 12 1969 1404 1410
    • (1969) Jpn J Appl Phys , vol.9 , Issue.12 , pp. 1404-1410
    • Furuta, N.1    Hamamura, K.2
  • 14
    • 0000643191 scopus 로고
    • Irreversible process of spontaneous whisker growth in bimetallic Cu-Sn thin film reactions
    • K.N. Tu Irreversible process of spontaneous whisker growth in bimetallic Cu-Sn thin film reactions Phys Rev B 49 3 1994 2030 2034
    • (1994) Phys Rev B , vol.49 , Issue.3 , pp. 2030-2034
    • Tu, K.N.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.