Rapid whisker growth on the surface of Sn-3Ag-0.5Cu-1.0Ce solder joints

Scripta Materialia

Volumn 55, Issue 11, 2006, Pages 983-986

  Chuang, Tung Han ^a  

^a NATIONAL TAIWAN UNIVERSITY   (Taiwan)

Author keywords

Hillocks; Rare earth element; Sn 3Ag 0.5Cu 1.0Ce; Tin whiskers

Indexed keywords

COMPRESSIVE STRESS; CRYSTAL GROWTH; OXIDATION; RARE EARTH ELEMENTS; SILVER; SOLDERED JOINTS; TIN;

HILLOCKS; TIN WHISKERS; WHISKER GROWTH; WHISKER MORPHOLOGY;

CRYSTAL WHISKERS;

EID: 33748790378     PISSN: 13596462     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.scriptamat.2006.08.024     Document Type: Article

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